THERMALLY CONDUCTIVE RESIN COMPACT AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE RESIN COMPACT
申请人:Kaneka Corporation
公开号:EP2824131A1
公开(公告)日:2015-01-14
A resin molded article of the present invention includes at least a resin and an inorganic filler that is in a plate form, a spheroidal form, or a fiber form, in a region of 50% or more of a volume of the resin molded article, the resin having resin molecular chains oriented in a thickness direction of the resin molded article and the inorganic filler having a long axis oriented in an in-plane direction of the resin molded article, the resin molecular chains having an orientation degree α in a range of 0.6 or more and less than 1.0, the orientation degree being calculated by the following Formula (1), from a half-value width W obtained by wide-angle X-ray scattering measurement: orientation degree α=360°-ΣW/360°
wherein W is a half-value width of a scattering peak between the resin molecular chains, in an intensity distribution in directions of azimuth angles in a range of 0° to 360° in the wide-angle X-ray scattering measurement.
本发明的一种树脂模塑品至少包括树脂和无机填料,无机填料呈板状、球状或纤维状,占树脂模塑品体积的50%或以上,树脂具有沿树脂模塑品厚度方向取向的树脂分子链,无机填料具有沿树脂模塑品平面方向取向的长轴,树脂分子链的取向度α在0.取向度 α 在 0.6 或以上且小于 1.0 的范围内,取向度根据广角 X 射线散射测量得到的半值宽度 W 按下式 (1) 计算: 取向度 α=360°-ΣW/360°
其中,W 是广角 X 射线散射测量中方位角在 0° 至 360° 范围内的强度分布中,树脂分子链之间散射峰的半值宽度。