Provided is a thermoplastic resin having excellent thermal conductivity, in which thermoplastic resin a change in number average molecular mass caused by progress of polymerization occurring when the thermoplastic resin material is melted and a change in thermal conductivity caused by the change in number average molecular mass are low. The thermoplastic resin has (A) a specific structure and (B) ends of molecular chains sealed by a monofunctional low molecular weight compound. The resin itself has excellent thermal conductivity. The change in number average molecular mass becomes small during melting of the thermoplastic resin material, so that the change in thermal conductivity of the resin itself becomes small.
提供的是一种具有优异热导率的热塑性
树脂,其中该热塑性
树脂具有(A)特定结构和(B)由单官能低分子量化合物密封的分子链末端。当热塑性
树脂材料熔化时,由聚合进展引起的数量平均分子量变化以及由数量平均分子量变化引起的热导率变化都很小。该
树脂本身具有优异的热导率。在热塑性
树脂材料熔化过程中,数量平均分子量的变化变得很小,因此
树脂本身的热导率变化也很小。