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N1-(1-Methylethylidene)-N2-[2-[(1-methylethylidene)amino]ethyl]-1,2-ethanediamine | 16888-76-9

中文名称
——
中文别名
——
英文名称
N1-(1-Methylethylidene)-N2-[2-[(1-methylethylidene)amino]ethyl]-1,2-ethanediamine
英文别名
2-(propan-2-ylideneamino)-N-[2-(propan-2-ylideneamino)ethyl]ethanamine
N1-(1-Methylethylidene)-N2-[2-[(1-methylethylidene)amino]ethyl]-1,2-ethanediamine化学式
CAS
16888-76-9
化学式
C10H21N3
mdl
——
分子量
183.29
InChiKey
FPHDXPRLWRPJNS-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    -0.5
  • 重原子数:
    13
  • 可旋转键数:
    6
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.8
  • 拓扑面积:
    36.8
  • 氢给体数:
    1
  • 氢受体数:
    3

文献信息

  • PATTERNED FINE PARTICLE FILM STRUCTURES
    申请人:Ogawa Kazufumi
    公开号:US20100143665A1
    公开(公告)日:2010-06-10
    A patterned fine particle film structure includes a fine particle layer including fine particles arranged and bound to a surface of a substrate coated with a patterned film including a first film compound having a first functional group. The fine particles are coated with films including a first coupling agent having a first coupling reactive group that undergoes a coupling reaction with the first functional group to form a bond. The fine particle layer is bound by a bond formed through a coupling reaction. In an embodiment, fine particles coated with films of a film compound that reacts with the first coupling reactive group and the fine particles are alternately bound to the substrate.
    一种图案化的细颗粒薄膜结构包括一个细颗粒层,其中包括排列并粘结在涂有包括第一功能基团的第一薄膜化合物的基底表面上的细颗粒。这些细颗粒被覆盖有包括第一偶联试剂的薄膜,该薄膜具有第一偶联反应基团,该基团与第一功能基团发生偶联反应形成化学键。细颗粒层通过偶联反应形成的键粘结在一起。在一种实施方式中,被涂覆有与第一偶联反应基团发生反应的薄膜化合物的细颗粒交替地粘结到基底上。
  • Curable Resin Composition and Cold Setting Adhesive
    申请人:Mori Shigeki
    公开号:US20090264602A1
    公开(公告)日:2009-10-22
    Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX 1 X 2 X 3 or —SiR 1 X 1 X 2 (wherein, X 1 , X 2 and X 3 respectively represent a hydrolytic group and may be the same as or different from each other, and R 1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR 1 X 1 X 2 , the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.
    本发明公开了一种含有湿度固化型可固化树脂组成物,包括:具有硅含有官能团的可固化树脂分子内部;以及作为固化催化剂的路易斯酸或路易斯酸的复合物,所述路易斯酸选择自金属卤化物和硼卤化物的组中,该组成物在室温下快速固化。硅含有官能团由通式表示:—SiX1X2X3或—SiR1X1X2(其中,X1、X2和X3分别表示一个水解基团,可以相同或不同,R1表示具有1到20个碳的取代或未取代的有机基团)。如果硅含有官能团为—SiR1X1X2,则可固化树脂还包含分子内部的极性组分之一,该极性组分为脲、硫脲、尿素、硫代尿素、取代尿素、取代硫脲、酰胺和硫化物键以及羟基、次级氨基和三级氨基基团。可将可固化树脂与固化催化剂分离以构成两部分型粘合剂。
  • PROCESS FOR THE PREPARATION OF URETHANE RESINS AND URETHANE RESIN COMPOSITIONS
    申请人:KONISHI CO., LTD.
    公开号:EP0919582A1
    公开(公告)日:1999-06-02
    A process for the preparation of urethane resins, which comprises the steps of reacting a silicon compound having one organic group (I) having one primary amino, acryloyl, epoxy or mercapto group in the group and at least one hydrolyzable group bonded to the silicon atom with an organic compound having an organic group (II) reactive with the organic group (I) to prepare a silicon compound (product A) having a secondary amino or hydroxyl group, reacting a polyol compound with a polyisocyanate compound to prepare a urethane prepolymer (product B) containing terminal NCO groups in an amount of 4 % or below, and reacting the product A with the product B in proportions of at least 0.5 equivalent of the product A per free NCO group of the product B; and resin compositions containing the urethane resins prepared by the process. The process can readily give urethane resins which exhibit excellent storage stability and are enhanced in the degrees of freedom of physical properties of products of curing.
    一种制备聚氨酯树脂的工艺,包括以下步骤:将具有一个有机基团(I)的硅化合物与具有与有机基团(I)反应的有机基团(II)的有机化合物反应,该有机基团(I)具有一个伯氨基、丙烯酰基、环氧基或巯基,且至少有一个可水解基团与硅原子键合,以制备具有仲氨基或羟基的硅化合物(产品 A)、将多元醇化合物与多异氰酸酯化合物反应,制备含有末端 NCO 基团的聚氨酯预聚物(产品 B),其含量为 4% 或以下,并将产品 A 与产品 B 反应,反应比例为每游离的产品 A 至少 0.5 当量的产品 A 与产品 B 进行反应;以及含有通过该工艺制备的聚氨酯树脂的树脂组合物。该工艺可轻易制备出贮存稳定性极佳且固化产物物理性质自由度更高的聚氨酯树脂。
  • CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION
    申请人:KONISHI CO., LTD.
    公开号:EP1616886A1
    公开(公告)日:2006-01-18
    An object of the present invention is to provide a curable resin having a silyl group at the terminal that is also moisture-hardening resin which has lower in viscosity when it is used and provides superior adhesiveness when it is utilized for adhesive, sealant, and paint. The object of the invention could be achieved by a curable resin that has silicon atom-containing groups having a silicon atom bound to one or more hydrolysable groups such as alkoxy groups, acetoxy groups and oxim groups at the ends of the molecule , thioether and hydroxyl groups in the molecule, and a polymer having a polyoxyalkylene, (meth)acrylic ester, or hydrocarbon polymer as the main chain skeleton.
    本发明的目的是提供一种末端带有硅基的可固化树脂,它也是一种湿硬化树脂,使用时粘度较低,用于粘合剂、密封剂和涂料时具有优异的粘合性。本发明的目的可以通过以下方法实现:一种可固化树脂,其含有硅原子,硅原子与一个或多个可水解基团结合,如分子末端的烷氧基、乙酰氧基和肟基,分子中的硫醚和羟基,以及以聚氧亚烷基、(甲基)丙烯酸酯或烃类聚合物作为主链骨架的聚合物。
  • CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE
    申请人:KONISHI CO., LTD.
    公开号:EP1652891A1
    公开(公告)日:2006-05-03
    Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: -SiX1X2X3 or -SiR1 X1 X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is -SiR1 X1 X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.
    本发明公开了一种湿气固化型可固化树脂组合物,该组合物含有:分子内具有含硅官能团的可固化树脂;以及作为固化催化剂的路易斯酸或路易斯酸的复合物,路易斯酸选自金属卤化物和硼卤化物组成的组,可在室温下快速固化。含硅官能团由通式表示:-SiX1X2X3或-SiR1 X1 X2(其中,X1、X2和X3分别代表水解基团,可以相同或不同,R1代表具有1至20个碳原子的取代或未取代的有机基团)。如果含硅官能团为-SiR1 X1 X2,则可固化树脂分子内进一步含有极性组分,该极性组分为聚氨酯、硫氨酯、脲、硫脲、取代脲、取代硫脲、酰胺键、硫化物键以及羟基、仲氨基和叔氨基中的一种。双组分型粘合剂可将可固化树脂与固化催化剂分开。
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