LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER FOIL AND LAMINATE
申请人:AMOU Satoru
公开号:US20110088933A1
公开(公告)日:2011-04-21
A wiring board comprising a copper wiring, and an insulating layer which is a cured product of a resin composition containing a compound having a carbon-carbon unsaturated double bond as a cross-linking component,
the wiring board having a surface-treated layer formed on one or both sides of the copper wiring, and
the surface-treated layer having a metal layer (A) containing at least one metallic component selected from the group consisting of tin, zinc, nickel, chromium, cobalt and aluminium,
an oxide and/or hydroxide layer (B) of the metallic component on the metal layer (A),
an amino-silane coupling agent layer (C) having an amino group in its structure on the oxide and/or hydroxide layer (B), and
a vinyl-silane coupling agent layer (D) having a carbon-carbon unsaturated double bond on the amino-silane coupling agent layer (C).
Intramolecular [2+2] Photocycloaddition. 14. Cycloreversion of Cyclophanes Possessing a Cyclobutane Ring at Their Tether
作者:Jun Nishimura、Yasuhiro Wada、Yukari Sano
DOI:10.1246/bcsj.65.618
日期:1992.2
Thermal cycloreversion of ten cyclophanes possessing a cyclobutane ring at their tether was examined. The rates were affected not only by their strain but also by their structural characteristics, such as meta- or para-configuration. The relative rate difference covered a range of the order of 106.