Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.
包含一种或多种表面活性剂的工艺溶液用于减少半导体器件制造过程中的缺陷数量。在某些优选的实施方案中,本发明的工艺溶液在
CMP 加工过程中或加工后作为冲洗溶液使用时,可减少缺陷。此外,还公开了一种采用本发明工艺溶液减少经
CMP 处理后的多个基板上缺陷数量的方法。