3,4-dihydroxy-[1]naphthoic acid | 861073-81-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 3,4-dihydroxy-[1]naphthoic acid
• 英文别名: 3,4-Dihydroxy-[1]naphthoesaeure；3.4-Dioxy-naphthalin-carbonsaeure-(1)；3,4-Dihydroxynaphthalene-1-carboxylic acid
• CAS: 861073-81-6
• 化学式: C₁₁H₈O₄
• 分子量: 204.182
• InChiKey: OPDVARYQRSDBEK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2
• 重原子数：
  15
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  77.8
• 氢给体数：
  3
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  3,4-dihydroxy-[1]naphthoic acid 、 硝酸 生成 3,4-dioxo-3,4-dihydro-[1]naphthoic acid
  参考文献：
  名称：

  Winogradowa; Schwezow; Schemjakin, Zhurnal Obshchei Khimii, 1949, vol. 19, p. 507,513, 514

  摘要：

  DOI：
• 作为产物：
  描述：

  3,4-dioxo-3,4-dihydro-[1]naphthoic acid 在 sodium hydrogensulfite 作用下， 生成 3,4-dihydroxy-[1]naphthoic acid
  参考文献：
  名称：

  Heller, Chemische Berichte, 1912, vol. 45, p. 678

  摘要：

  DOI：

文献信息

• RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20200183273A1

  公开（公告）日：2020-06-11

  A resist composition including a base material component (A) whose solubility in a developing solution is changed due to the action of an acid, and a compound (D0) formed of an anion moiety and a cation moiety which is represented by Formula (d0), in which the cation moiety of the compound (D0) has a Log P value of less than 7.7. In the formula, M m+ represents an m-valent organic cation, R d0 represents a substituent, p represents an integer of 0 to 3, q represents an integer of 0 to 3, n represents an integer of 2 or greater, and a relationship of “n+p≤(q×2)+5” is satisfied.

  一种抗蚀组合物，包括一种基材料组分（A），由于酸的作用而在显影液中溶解性发生改变，以及由阴离子基团和由公式（d0）表示的阳离子基团组成的化合物（D0）。其中，化合物（D0）的阳离子基团的Log P值小于7.7。在公式中，Mm+表示m价有机阳离子，Rd0表示取代基，p表示0到3之间的整数，q表示0到3之间的整数，n表示大于等于2的整数，并且满足“n+p≤（q×2）+5”的关系。
• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。
• COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF
  申请人：Nippon Soda Co., Ltd.

  公开号：EP2489689A1

  公开（公告）日：2012-08-22

  An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): (A) an epoxy resin; (B) a clathrate compound of a carboxylic acid derivative represented by formula (I):         R(COOH)n     (I); and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).

  本发明的目的是提供一种用于形成固化环氧树脂的组合物，其中该组合物可以在低温下抑制固化反应，从而提高单包稳定性，还可以进行加热处理，从而有效地固化树脂。本发明提供了一种用于形成固化环氧树脂的组合物，该组合物包括以下组分（A）、（B）和（C）： (A) 环氧树脂； (B) 由式(I)代表的羧酸衍生物的凝块化合物： R(COOH)n (I)； 和式 (II) 所代表的咪唑化合物；以及 (C) 式 (III) 所代表的四联酚型化合物。
• CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME
  申请人：Nippon Soda Co., Ltd.

  公开号：EP2573148A1

  公开（公告）日：2013-03-27

  Disclosed is an epoxy or epoxy-polyester curable powder coating composition which can form a favorable cured coating film excellent in adhesion and solvent resistance and is excellent in storage stability. The curable powder coating composition of the present invention contains the following component (A) and component (B): (A) an epoxy resin or an epoxy-polyester hybrid resin; and (B) a clathrate complex which contains (b1) at least one selected from the group consisting of a carboxylic acid compound and a tetrakisphenol compound represented by the following formula (I), and (b2) at least one selected from compounds represented by formula (II). The carboxylic acid compound preferably includes an aromatic carboxylic acid.

  本发明公开了一种环氧或环氧-聚酯可固化粉末涂料组合物，该组合物可形成附着力和耐溶剂性优异的固化涂膜，并具有出色的贮存稳定性。本发明的可固化粉末涂料组合物包含以下组分（A）和组分（B）：（A）环氧树脂或环氧-聚酯混合树脂；和（B）凝胶络合物，其中包含（b1）至少一种选自下式（I）所代表的羧酸化合物和四双酚化合物，以及（b2）至少一种选自下式（II）所代表的化合物。羧酸化合物最好包括芳香族羧酸。
• Protective film-forming composition
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US11112696B2

  公开（公告）日：2021-09-07

  A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent: (wherein R1 is a C1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)

  一种用于形成针对过氧化氢水溶液的保护膜的组合物，包括： 下式（1a）或式（1b）的化合物或具有下式（2）取代基且分子量为 300 或以上且小于 800 或重量平均分子量为 300 或以上且小于 800 的化合物；以及溶剂，该组合物含有下式（1a）或式（1b）的化合物 0.相对于不包括溶剂的固体，该组合物含有质量分数为 0.1%至 60%的式 (1a) 或式 (1b) 化合物，或质量分数为 10%至 100%的具有式 (2) 取代基的化合物： (其中 R1 为 C1-4 亚烷基或烯基或直接键，k 为 0 或 1，m 为 1 至 3 的整数，n 为 2 至 4 的整数）。