1,3-dimethyl-2-methoxynaphthalene | 74866-29-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 1,3-dimethyl-2-methoxynaphthalene
• 英文别名: 2-methoxy-1,3-dimethylnaphthalene
• CAS: 74866-29-8
• 化学式: C₁₃H₁₄O
• 分子量: 186.254
• InChiKey: XXWDIRFINTWWLS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.9
• 重原子数：
  14
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  1,3-dimethyl-2-methoxynaphthalene 在 thallium(III) trifluoroacetate 作用下， 以 三氟乙酸 为溶剂， 生成 3'-Methoxy-1,3,2',4'-tetramethyl-1H-[1,1']binaphthalenyl-2-one
  参考文献：
  名称：

  Thallium in organic synthesis. 58. Regiospecific intermolecular oxidative dehydrodimerization of aromatic compounds to biaryls using thallium(III) trifluoroacetate

  摘要：

  DOI：

  10.1021/ja00541a020
• 作为产物：
  描述：

  2-methoxy-3-methyl-1-naphthaldehyde 在 氢氧化钾 、 一水合肼 作用下， 生成 1,3-dimethyl-2-methoxynaphthalene
  参考文献：
  名称：

  Thallium in organic synthesis. 58. Regiospecific intermolecular oxidative dehydrodimerization of aromatic compounds to biaryls using thallium(III) trifluoroacetate

  摘要：

  DOI：

  10.1021/ja00541a020

文献信息

• Pd-Catalyzed <i>ipso</i>,<i>meta</i>-Dimethylation of <i>ortho</i>-Substituted Iodoarenes via a Base-Controlled C–H Activation Cascade with Dimethyl Carbonate as the Methyl Source
  作者：Zhuo Wu、Feng Wei、Bin Wan、Yanghui Zhang

  DOI：10.1021/jacs.0c13057

  日期：2021.3.31

  the ipso- and meta-positions of the iodo group, which represents a novel strategy for meta-C–H methylation. With KOAc as the base, subsequent oxidative C(sp3)–H/C(sp3)–H coupling occurs; in this case, the overall transformation achieves triple C–H activation to form three new C–C bonds. These reactions allow expedient access to 2,6-dimethylated phenols, 2,3-dihydrobenzofurans, and indanes, which are ubiquitous

  甲基可以对有机分子的药理特性产生深远的影响。因此，开发甲基化方法和甲基化试剂在药物化学中是必不可少的。我们报告了使用碳酸二甲酯作为甲基源的邻位取代碘芳烃的钯催化二甲基化反应。在K的存在2 CO 3作为碱，iodoarenes是在二甲基化本位以及-元的碘基团，它代表一种新颖的策略的位上的元-C-H甲基化。以 KOAc 为碱，随后的氧化 C(sp 3 )–H/C(sp 3)–H 耦合发生；在这种情况下，整体转化实现了三重 C-H 激活，形成三个新的 C-C 键。这些反应可以方便地获得 2,6-二甲基苯酚、2,3-二氢苯并呋喃和茚满，它们是普遍存在的结构基序和生物和药理活性化合物的基本合成中间体。
• PPh₃AuTFA Catalyzed in the Dearomatization of 2-Naphthols with Allenamides
  作者：Juzeng An、Lorenzo Lombardi、Stefano Grilli、Marco Bandini

  DOI：10.1021/acs.orglett.8b03018

  日期：2018.12.7

  A new catalytic methodology for the direct dearomatization of substituted 2-naphthols via intermolecular condensation with allenamides is presented. PPh(3)AuTFA (5 mol %) promotes the formal allylating dearomative protocol under mild conditions, large scope (24 examples), and high regioselectivity and stereoselectivity. The synergistic catalytic role played by the [PPh3Au](+) (pi-acid) and TFA(-) (Lewis base) is highlighted.
• MCKILLOP A.; TURRELL A. G.; YOUNG D. W.; TAYLOR E. C., J. AMER. CHEM. SOC., 1980, 102, NO 21, 6504-6512
  作者：MCKILLOP A.、 TURRELL A. G.、 YOUNG D. W.、 TAYLOR E. C.

  DOI：——

  日期：——
• Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
  申请人：Ogura Ichiro

  公开号：US20080255315A1

  公开（公告）日：2008-10-16

  An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
• EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN
  申请人：Ogura Ichirou

  公开号：US20090054585A1

  公开（公告）日：2009-02-26

  The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.