CURING AGENTS FOR LOW-EMISSION EPOXY RESIN PRODUCTS
申请人:SIKA TECHNOLOGY AG
公开号:US20150344615A1
公开(公告)日:2015-12-03
The present invention relates to curing agents for epoxy resins, containing at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether. The curing agent has a low viscosity and cures quickly together with epoxy resins even in moist, cold conditions and without blushing to form films with a high hardness and surface quality, which scarcely undergo yellowing upon exposure to light. It is particularly suited for low-emission room temperature-curing coatings.
US9790319B2
申请人:——
公开号:US9790319B2
公开(公告)日:2017-10-17
KLEMM D.; BELLSTEDT K.; HOERHOLD H., J. PRAKT. CHEM., 1979, 321, NO 4, 680-682