The present invention relates to a polyamide resin composition comprising:
100 parts by weight of a polyamide resin mixture comprising
(A) 20 to 90% by weight of a polyamide 6 resin and/or polyamide 66 resin and
(B) 10 to 80% by weight of an aromatic polyamide resin;
and
(C) 0 to 300 parts by weight of an inorganic filler, the said aromatic polyamide resin having diamine units comprising 10 to 50 mol% of paraxylylenediamine units and 50 to 90 mol% of methaxylylenediamine units, and aliphatic dicarboxylic acid units, proviso that when the amount of the said inorganic filler is not less than 45 parts by weight, the said polyamide resin composition further comprises at least one component selected from the group consisting of
(D) 0.05 to 5 parts by weight of a light stabilizer,
(E) 0.05 to 5 parts by weight of a phenolic antioxidant and
(F) 0.01 to 5 parts by weight of a copper compound and/or a halide,
based on 100 parts by weight of the polyamide resins (A) and (B).
本发明涉及一种聚酰胺
树脂组合物,包括
100 重量份的聚酰胺
树脂混合物,包括
(A) 20-90%(按重量计)的聚酰胺 6
树脂和/或聚酰胺 66
树脂和
(B) 10%至 80%(重量百分比)的芳香族聚酰胺
树脂;
和
(C) 0 至 300 份(重量)无机填料,所述芳香族聚酰胺
树脂的二胺单元包括 10 至 50 摩尔%的对羟基二胺单元和 50 至 90 摩尔%的甲羟基二胺单元,以及脂肪族二
羧酸单元,但当所述无机填料的用量不少于 45 份(重量)时,所述聚酰胺
树脂组合物还包括至少一种选自以下组别的组分: (D) 0.05 至 5.5 份(重量)无机填料,所述无机填料的用量不少于 45 份(重量)
(D) 0.05 至 5 重量份的
光稳定剂、
(E) 0.05 至 5 份(按重量计)
酚类抗氧化剂和
(F) 0.01 至 5 份(按重量计)
铜化合物和/或卤化物、
以 100 重量份的聚酰胺
树脂(A)和(B)为基准。