AQUEOUS PRIMER COMPOSITION AND INK SET, AND PRINTED MATTER
申请人:Sakata INX Corporation
公开号:EP3878915A1
公开(公告)日:2021-09-15
An object is to obtain an aqueous primer that offers excellent preservation stability and, when printing images, text, etc., to form a printing layer on a plastic film or other nonabsorbent medium using inkjet recording ink compositions, allows for formation of a printing layer having high adhesion, capable of forming high-quality images with little bleeding/mottled appearance, and offering excellent water resistance and lamination suitability. The solution is to provide: an aqueous primer composition containing a water-soluble multivalent metal salt, a polyester-based polyurethane emulsion, and water; a set including the aqueous primer composition and an inkjet recording ink composition; and a printed matter comprising a base material layer, a primer layer containing a water-soluble multivalent metal salt and a polyester-based polyurethane, and a printing layer.
Post chemical mechanical polishing formulations and method of use
申请人:Entegris, Inc.
公开号:US10731109B2
公开(公告)日:2020-08-04
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material. In addition, the cleaning compositions are compatible with ruthenium-containing materials.
The disclosure generally relates to a composition and process for cleaning residue and/or contaminants from microelectronic devices having said residue and contaminants thereon. The residue may include post-CMP, post-etch, and/or post-ash residue. The compositions and methods are particularly advantageous when cleaning a microelectronic surface comprising copper, low-k dielectric materials, and barrier materials comprising at least one of tantalum-containing material, cobalt-containing material, tantalum-containing, tungsten-containing, and ruthenium-containing material.
A cleaning composition and process for cleaning an in-process microelectronic device substrate, e.g., by post-chemical mechanical polishing (CMP) cleaning, to remove residue from a surface thereof, wherein the cleaning composition may be especially effective for cleaning a substrate surface that includes exposed metal such as cobalt, copper, or both, along with dielectric or low k dielectric material, and wherein the cleaning composition includes corrosion inhibitor to inhibit corrosion of the exposed metal.
A non-aqueous laminate adhesive comprising a tertiary amino group-containing polyurethane resin (A) or a tertiary amino group- and carboxyl group-containing polyurethane resin (B) and a polyisocyanate curing agent. The resin (A) is obtained from (1) an active hydrogen group-containing compound comprising at least a tertiary amino group- and hydroxyl group-containing compound and (3) an organic polyisocyanate; and the resin (B) is obtained from (2) an active hydrogen group-containing compound comprising at least a tertiary amino group- and hydroxyl group-containing compound and a carboxyl group- and hydroxyl group-containing compound and (3) an organic polyisocyanate. The content of the tertiary amino group in the resin (A), the content of the tertiary amino group in the resin (B), and the carboxyl group in the resin (B) are each 0.001 to 1 mmol/g.
The non-aqueous laminate adhesive has a short aging time, a long pot life and good storage stability, all of which have been unachievable with conventional laminate adhesives.