A radiation-sensitive resin composition comprising (A) an acid-dissociable group-containing polysiloxane and (B) a photoacid generator containing trifluoromethane sulfonic acid or a compound which generates an acid of the following formula (I),
1
wherein Rf individually represents a fluorine atom or a trifluoromethyl group, and Ra represents a hydrogen atom, a fluorine atom, a linear or branched alkyl group having 1-20 carbon atoms, or a linear or branched fluoroalkyl group having 1-20 carbon atoms, a substituted or unsubstituted monovalent cyclic hydrocarbon group having 3-20 carbon atoms, or a substituted or unsubstituted monovalent cyclic fluoro-hydrocarbon group having 3-20 carbon atoms. The radiation-sensitive resin composition of the present invention exhibits superior resolution, while maintaining high transparency to radiations and high dry etching resistance. The resin composition thus can greatly contribute to the lithography process that will become more and more minute in the future.
一种辐射敏感的
树脂组合物,包括(A)含有酸可解离基团的聚
硅氧烷和(B)含有三
氟甲烷磺酸或生成以下式(I)酸的化合物的光酸发生剂,其中Rf分别表示
氟原子或三
氟甲基基团,Ra表示氢原子,
氟原子,具有1-20个碳原子的线性或支链烷基,或具有1-20个碳原子的线性或支链氟烷基,具有3-20个碳原子的取代或未取代的单价
环烃基或具有3-20个碳原子的取代或未取代的单价环
氟烃基。本发明的辐射敏感
树脂组合物表现出优异的分辨率,同时保持对辐射的高透明度和高干法刻蚀抵抗力。因此,该
树脂组合物可以为未来变得越来越微小的光刻工艺做出巨大贡献。