METHODS FOR MEASURING DEGREE CURE OR SOLIDIFICATION OF A COMPOSITION
申请人:Henkel Corporation
公开号:EP2643681A2
公开(公告)日:2013-10-02
METHODS FOR MEASURING DEGREE OF CURE OR SOLDIFICATION OF A COMPOSITION
申请人:Henkel Corporation
公开号:US20130171651A1
公开(公告)日:2013-07-04
The present invention is directed to methods of measuring the degree of cure or solidification of a composition. Desirably, such methods are quantitative and ascertain the degree of cure or solidification in a non-destructive manner such that they are adaptable for on-line, real-time monitoring.
US9176061B2
申请人:——
公开号:US9176061B2
公开(公告)日:2015-11-03
[EN] METHODS FOR MEASURING DEGREE CURE OR SOLIDIFICATION OF A COMPOSITION<br/>[FR] PROCÉDÉS POUR MESURER LE DEGRÉ DE DURCISSEMENT OU DE SOLIDIFICATION D'UNE COMPOSITION
申请人:HENKEL CORP
公开号:WO2012071304A2
公开(公告)日:2012-05-31
The present invention is directed to methods of measuring the degree of cure or solidification of a composition. Desirably, such methods are quantitative and ascertain the degree of cure or solidification in a non-destructive manner such that they are adaptable for on-line, real-time monitoring.