申请人:Shigeura S. John
公开号:US20060046304A1
公开(公告)日:2006-03-02
A device, system, and method are provided for thermally treating a fluid processing device. According to various embodiments, a system is provided that can include a thermal device and a fluid processing device holder. The thermal device can include a first block having a thermal conductivity greater than 0.5 Watt per centimeter Kelvin (W/cm·K), a second block having a thermal conductivity greater than 0.5 W/cm·K, and a heat-pump device disposed between the first block and the second block. The heat-pump device can transfer thermal energy from at least one of the first block and the second block to the other of the first block and the second block. The fluid processing device holder can hold a fluid processing device in a heat-transfer position with respect to the first block and the second block. The fluid processing device can be a microfluidic device.
提供了一种对流体处理设备进行热处理的设备、系统和方法。根据不同的实施例,提供的系统可包括热设备和流体处理设备支架。热设备可包括导热系数大于 0.5 瓦特/厘米-开尔文(W/cm-K)的第一块、导热系数大于 0.5 瓦特/厘米-开尔文(W/cm-K)的第二块,以及设置在第一块和第二块之间的热泵装置。热泵装置可将热能从第一块和第二块中的至少一块传递到第一块和第二块中的另一块。流体处理装置支架可将流体处理装置固定在相对于第一区块和第二区块的热传递位置。流体处理装置可以是微流体装置。