1,1,1-tris(3,5-dimethoxymethyl-4-hydroxyphenyl)ethane | 672926-26-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: 1,1,1-tris(3,5-dimethoxymethyl-4-hydroxyphenyl)ethane
• 英文别名: Phenol, 4,4',4''-ethylidynetris[2,6-bis(methoxymethyl)-；4-[1,1-bis[4-hydroxy-3,5-bis(methoxymethyl)phenyl]ethyl]-2,6-bis(methoxymethyl)phenol
• CAS: 672926-26-0
• 化学式: C₃₂H₄₂O₉
• 分子量: 570.68
• InChiKey: IIFLIWFOXRRHDA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.7
• 重原子数：
  41
• 可旋转键数：
  15
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.44
• 拓扑面积：
  116
• 氢给体数：
  3
• 氢受体数：
  9

反应信息

• 作为产物：
  描述：

  2,6-二甲基苯酚 在 N-溴代丁二酰亚胺(NBS) 、 甲烷磺酸 、 三氟化硼乙醚 、 巯基乙酸 、 N,N-二异丙基乙胺 、 过氧化苯甲酰 作用下， 以 四氯化碳 、 乙二醇二甲醚 、 二氯甲烷 、 氯仿 为溶剂， 反应 14.0h， 生成 1,1,1-tris(3,5-dimethoxymethyl-4-hydroxyphenyl)ethane
  参考文献：
  名称：

  CN115959977

  摘要：

  公开号：

文献信息

• Novolac resin-containing resist underlayer film-forming composition using bisphenol aldehyde
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US10017664B2

  公开（公告）日：2018-07-10

  Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.

  用于形成具有高干法蚀刻抗性、抗扭曲性并具有良好的平整性和嵌入性能的抗蚀底层膜形成组合物，包括通过使含有芳香环的有机化合物A和至少具有两个含酚羟基的芳香烃环团的醛B反应而获得的树脂，并具有芳香烃环团通过三级碳原子键合的结构。醛B可以是化合物的化学式（1）： 所得的树脂可能具有化学式（2）的单元结构： Ar1和Ar2各自是C6-40芳基团。含有芳香环的有机化合物A可能是芳香胺或含酚羟基的化合物。该组合物可能进一步含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成抗蚀图案，包括通过将抗蚀底层膜形成组合物涂覆在半导体衬底上并对其进行烘烤来形成抗蚀底层膜。
• NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20190169211A1

  公开（公告）日：2019-06-06

  The present invention has been made in view of the circumstances herein. An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).

  本发明是基于本文中的情况而作出的。本发明的目的是提供：一种四羧酸二酐，可导致聚酰亚胺，作为感光树脂组合物的基树脂，能够形成细微图案并获得高分辨率，同时不损害优异的特性，如机械强度和粘附性；通过使用该四羧酸二酐获得的聚酰亚胺树脂；以及生产该聚酰亚胺树脂的方法。该四羧酸二酐由以下通用式（1）所示。
• COMPOUND FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20170184968A1

  公开（公告）日：2017-06-29

  A compound for forming an organic film shown by the formula (1A), R—(—X) m1 (1A) wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and ml represents an integer satisfying 2≦m1≦10, wherein X 2 represents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; X 3 represents a group shown by the formula (1C); and n5 represents 0, 1, or 2, wherein R 10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.

  一种用于形成有机薄膜的化合物，其化学式为(1A)，R—(—X)m1(1A)，其中R代表一个单键或具有1至50个碳原子的有机基团；X代表化学式(1B)所示的基团；m1代表满足2≦m1≦10的整数，其中X2代表具有1至10个碳原子的二价有机基团；n1代表0或1；n2代表1或2；X3代表化学式(1C)所示的基团；n5代表0、1或2，其中R10代表氢原子或具有1至10个碳原子的饱和或不饱和碳氢基团，化学式(1C)中苯环的氢原子可能被甲基基团或甲氧基取代。这种用于形成有机薄膜的化合物可以提供具有良好干法刻蚀抗性、耐高温至400°C或更高、高填充和平整化性能的有机薄膜组合物。
• Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US10197914B2

  公开（公告）日：2019-02-05

  The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.

  本发明提供了一种含有（A）含有硅氧烷链的聚合物化合物的阳性感光树脂组合物，该聚合物化合物具有由通式（1）所示的重复单元和重量平均分子量为3,000至500,000，（B）能够通过光生成酸并增加在水性碱性溶液中的溶解速率的感光材料，（C）交联剂和（D）溶剂。可以提供一种阳性感光树脂组合物，可以解决在金属线路（如Cu和Al）、电极和基板上引起的剥离问题，特别是在SiN等基板上，可以在使用广泛的2.38％TMAH水溶液作为显影剂时，在图案底部和基板上形成具有前向锥形形状的细微图案，而不会产生污点和底部轮廓。
• NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：International Business Machines Corporation

  公开号：US20210317270A1

  公开（公告）日：2021-10-14

  Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X 1 to X 3 represent any of —CO 2 —, —CONR X1 —, —O—, —NR X1 —, —S—, —SO 2 —, —SO 3 — and —SO 2 NR X1 — and may be the same as or different from each other, provided that R X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L 1 and L 2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.

  提供的是一种可以用作光敏树脂组合物的基树脂的化合物。这种光敏树脂可以形成精细图案，并且可以在不影响机械强度和溶解性的情况下实现高分辨率。该化合物由通式（1）表示：其中Z代表具有2到30个碳原子的线性、支链或环状二价碳氢基团；X1到X3代表任何一种—CO2—、—CONRX1—、—O—、—NRX1—、—S—、—SO2—、—SO3—和—SO2NRX1—中的一种，并且它们可以相同也可以不同，只要RX1是氢原子或具有1到30个碳原子的一价碳氢基团；Ar代表具有2到30个碳原子的二价芳香基团；L1和L2分别代表具有1到30个碳原子的二价碳氢基团；x和y分别独立地为0或1。