The present invention relates to compounds of the formula (I), to the use of compounds of the formula (I) in electronic devices and electronic devices comprising one or more compounds of the formula (I). The invention furthermore relates to the preparation of the compounds of the formula (I) and to formulations comprising one or more compounds of the formula (I).
Synthesis of 10<i>H</i>-di(1-benzothiopheno)[2,3-<i>b</i>:3′,2′-<i>d</i>]pyrrole: re-investigation of the Cadogan cyclization route
作者:Yuma Tanioka、Shigeki Mori、Masayoshi Takase、Hidemitsu Uno
DOI:10.1093/bulcsj/uoae010
日期:2024.3.1
The reaction of 2-nitro-3,3′-bi(1-benzothiophene) bearing ester groups at 7- and 7′-positions under the Cadogan cyclization conditions (PPh3, o-C6H4Cl2, refl.) afforded the targeted 10H-di(1-benzothiopheno)[2,3-b:3′,2′-d]pyrrole-1,8-dicarboxylate derivative in a low yield accompanied with a byproduct. On the other hand, the Cadogan reaction of 2-nitro-3,3′-bi(1-benzothiophene) without ester groups
在卡多根环化条件下,2-硝基-3,3′-双(1-苯并噻吩)酯基团在 7-和 7-位置(PPh3,o-C6H4Cl2,refl.)的反应得到了靶向的 10H-二(1-苯并硫代苯基)[2,3-b:3′,2′-d]吡咯-1,8-二羧酸酯衍生物,产量低,伴有副产物。另一方面,没有酯基的 2-硝基-3,3′-bi(1-苯并噻吩)的 Cadogan 反应没有提供相应的吡咯,而是得到噻吩开环产物的混合物,从中分离出二苯并硫代噻噻吩吡喃。通过光谱和 X 射线分析对这些开环产物的结构进行了充分表征,并推导出了产生副产物的产生机制。原始的 10H-二(1-苯并硫代苯基)[2,3-b:3′,2′-d]吡咯可以通过另一种途径制备,即亚硝化,然后环化和还原。
Materials for electronic devices
申请人:Merck Patent GmbH
公开号:US10749117B2
公开(公告)日:2020-08-18
The present invention relates to compounds of the formula (I), to the use of compounds of the formula (I) in electronic devices and electronic devices comprising one or more compounds of the formula (I). The invention furthermore relates to the preparation of the compounds of the formula (I) and to formulations comprising one or more compounds of the formula (I).
[DE] MATERIALIEN FÜR ELEKTRONISCHE VORRICHTUNGEN<br/>[EN] MATERIALS FOR ELECTRONIC DEVICES<br/>[FR] MATÉRIAUX POUR DISPOSITIFS ÉLECTRONIQUES
申请人:MERCK PATENT GMBH
公开号:WO2012016630A1
公开(公告)日:2012-02-09
Die vorliegende Erfindung betrifft Verbindungen gemäß Formel (I), die Verwendung von Verbindungen gemäß Formel (I) in elektronischen Vorrichtungen sowie elektronische Vorrichtungen enthaltend eine oder mehrere Verbindungen gemäß Formel (I). Weiterhin betrifft die Erfindung die Herstellung der Verbindungen gemäß Formel (I) sowie Formulierungen enthaltend eine oder mehrere Verbindungen gemäß Formel (I).