Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.
提供了一种可返修的导热粘合剂组合物,该组合物包含二
环氧化物的固化反应产物,其中环氧基团通过环
缩醛分子、
环酸酐和导热填料连接,用于将半导体器件粘合到芯片载体或散热器上。