3-{4-[1-(4-cyclohexylphenyl)-3-(2-[2,2,2-trifluoroethyl]-1,3-dioxo-2,3-dihydro1H-isoindol-5-yl)-ureidomethyl]benzoylamino}propionic acid | 428814-63-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 异吲哚及其衍生物
• 英文名称: 3-{4-[1-(4-cyclohexylphenyl)-3-(2-[2,2,2-trifluoroethyl]-1,3-dioxo-2,3-dihydro1H-isoindol-5-yl)-ureidomethyl]benzoylamino}propionic acid
• 英文别名: 3-[[4-[[4-cyclohexyl-N-[[1,3-dioxo-2-(2,2,2-trifluoroethyl)isoindol-5-yl]carbamoyl]anilino]methyl]benzoyl]amino]propanoic acid
• CAS: 428814-63-5
• 化学式: C₃₄H₃₃F₃N₄O₆
• 分子量: 650.654
• InChiKey: CYZZAWMSUTZHED-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.6
• 重原子数：
  47
• 可旋转键数：
  10
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.32
• 拓扑面积：
  136
• 氢给体数：
  3
• 氢受体数：
  9

文献信息

• Glucagon antagonists/inverse agonists
  申请人：——

  公开号：US20030065031A1

  公开（公告）日：2003-04-03

  Novel compounds, which act to antagonize the action of the glucagon hormone on the glucagon receptor. Owing to their antagonizing effect of the glucagon receptor the compounds may be suitable for the treatment and/or prevention of any diseases and disorders, wherein a glucagon antagonistic action is beneficial, such as hyperglycemia, Type 1 diabetes, Type 2 diabetes, disorders of the lipid metabolism and obesity.

  新化合物，其作用是拮抗胰高血糖素对胰高血糖素受体的作用。由于它们对胰高血糖素受体的拮抗作用，这些化合物可能适用于治疗和/或预防任何疾病和紊乱，其中胰高血糖素拮抗作用是有益的，如高血糖症、1型糖尿病、2型糖尿病、脂质代谢紊乱和肥胖症。
• Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board
  申请人：——

  公开号：US20040048978A1

  公开（公告）日：2004-03-11

  The present invention relates to a photosensitive resin composition having excellent heat resistance, processability, and adhesion, and a solder resist comprising the composition, a cover lay film, and a printed circuit board obtained from or with these. The cover lay film is excellent in processability and adhesion at relatively low temperatures and has a low elastic coefficient after curing while keeping sufficient mechanical strength, so that the cover lay film is preferably used for a printed circuit board or a hard disk. The cover lay film is soluble and can be laminated at temperatures of not higher than 150° C., and a solder resist having excellent properties, such as heat resistance which can be laminated directly onto FPC without any adhesives and a cover lay film having few warps when laminated onto the FPC can be provided according to the present invention. The photosensitive resin composition comprises as essential components: a soluble polyimide (A) dissolved in solvent having a boiling point of not higher than 120° C.; and a compound (B) having at least one aromatic ring and at least 2 double bonds in one molecule, wherein the soluble polyimide is one obtained at least from an acid dianhydride having 1 to 6 aromatic rings or alicyclic acid dianhydride and/or a diamine having 1 to 6 aromatic rings. The solder resist, cover lay film, etc. are excellent in heat resistance and mechanical properties and do not damage the substrate because they can be laminated at relatively low temperatures.

  本发明涉及一种具有优异的耐热性、加工性和附着力的光敏树脂组合物，以及一种由该组合物、覆盖层薄膜和印刷电路板组成的阻焊材料。覆盖膜在相对较低的温度下具有优异的加工性和附着力，固化后弹性系数低，同时保持足够的机械强度，因此覆盖膜最好用于印刷电路板或硬盘。根据本发明，盖层薄膜是可溶的，可以在不高于 150°C 的温度下层压，并且可以提供一种具有优异性能（如耐热性）的阻焊剂，这种阻焊剂可以不使用任何粘合剂直接层压到 FPC 上，并且层压到 FPC 上时盖层薄膜很少翘曲。光敏树脂组合物的主要成分包括：溶解在沸点不高于 120 摄氏度的溶剂中的可溶性聚酰亚胺（A）；以及在一个分子中至少具有一个芳香环和至少两个双键的化合物（B），其中可溶性聚酰亚胺至少是从具有 1 至 6 个芳香环的酸酐或脂环酸酐和/或具有 1 至 6 个芳香环的二胺中获得的。阻焊层、覆盖层薄膜等具有优异的耐热性和机械性能，并且不会损坏基材，因为它们可以在相对较低的温度下层压。
• US6706744B2
  申请人：——

  公开号：US6706744B2

  公开（公告）日：2004-03-16
• [EN] GLUCAGON ANTAGONISTS/INVERSE AGONISTS<br/>[FR] ANTAGONISTES/AGONISTES INVERSES DE GLUCAGON
  申请人：NOVO NORDISK AS

  公开号：WO2002040444A1

  公开（公告）日：2002-05-23

  Novel compounds, which act to antagonize the action of the glucagon hormone on the glucagon receptor. Owing to their antagonizing effect of the glucagon receptor the compounds may be suitable for the treatment and/or prevention of any diseases and disorders, wherein a glucagon antagonistic action is beneficial, such as hyperglycemia, Type 1 diabetes, Type 2 diabetes, disorders of the lipid metabolism and obesity.