4-methyl-9,9-bis(4-aminophenyl)fluorene | 133377-15-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 4-methyl-9,9-bis(4-aminophenyl)fluorene
• 英文别名: 4-[9-(4-Aminophenyl)-4-methylfluoren-9-yl]aniline
• CAS: 133377-15-8
• 化学式: C₂₆H₂₂N₂
• 分子量: 362.474
• InChiKey: PJBLZPUJWNTDPL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.7
• 重原子数：
  28
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  52
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• POLYIMIDE RESIN, RESIN COMPOSITION AND LAMINATED FILM THAT USE SAME
  申请人：Toray Industries, Inc.

  公开号：EP2735580A1

  公开（公告）日：2014-05-28

  An object is to provided a polyimide resin that is prevented from generation of volatiles due to decomposition or the like even at high temperatures equal to or higher than 25°C and has good adhesiveness, and a resin composition and a laminated film using the same. Provided is a polyimide resin having at least a tetracarboxylic dianhydride residue and a di-amine residue and having a glass transition temperature of 30°C or lower, wherein a residue of a polysiloxane di-amine represented by general formula (1) is contained as the di-amine residue, wherein n is a natural number and the average calculated from the average molecular weight of the polysiloxane di-amine is within the range of from 5 to 30; R1 and R2 may be the same or different and each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; R3 to R6 may be the same or different and each represent an alkylene group having 1 to 30 carbon atoms, a phenyl group, or a phenoxy group.

  目的是提供一种即使在等于或高于 25℃的高温下也不会因分解等原因产生挥发物且具有良好粘合性的聚酰亚胺树脂，以及使用该聚酰亚胺树脂的树脂组合物和层压薄膜。本发明提供了一种聚酰亚胺树脂，该树脂至少具有四羧酸二酐残留物和二胺残留物，玻璃化转变温度为 30℃或更低，其中二胺残留物为通式（1）代表的聚硅氧烷二胺残留物、 其中 n 为自然数，根据聚硅氧烷二胺的平均分子量计算的平均数在 5 至 30 的范围内；R1 和 R2 可以相同或不同，各自代表具有 1 至 30 个碳原子的亚烷基或亚苯基；R3 至 R6 可以相同或不同，各自代表具有 1 至 30 个碳原子的亚烷基、苯基或苯氧基。
• POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM
  申请人：Toray Industries, Inc.

  公开号：EP3112394A1

  公开（公告）日：2017-01-04

  Provided are: a polyimide resin which has high heat resistance and is capable of uniformly performing temporary adhesion over a large area with no void or the like; a resin composition using the same; and a laminated film. The polyimide resin of the present invention has at least an acid anhydride residue and a diamine residue and contains a residue of a polysiloxane diamine in an amount of not less than 60% by mole in the total amount of the diamine residue.

  本发明提供了：一种具有高耐热性并能在大面积上均匀地进行临时粘合且无空隙等的聚酰亚胺树脂；一种使用该树脂的树脂组合物；以及一种层压薄膜。本发明的聚酰亚胺树脂至少具有酸酐残留物和二胺残留物，并含有聚硅氧烷二胺残留物，其含量不低于二胺残留物总量的 60%（摩尔）。
• ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, METHOD FOR MANUFACTURING WAFER WORK PIECE AND SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION
  申请人：Toray Industries, Inc.

  公开号：EP3187559A1

  公开（公告）日：2017-07-05

  The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention is a temporary-bonding adhesive characterized by being a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol% of the (A1) residue and 0.01-60 mol% of the (B1) residue.

  本发明提供了：一种具有优异耐热性的临时粘接剂，可通过单一类型的粘接剂层粘接半导体电路形成基板和支撑基板，其粘接力在制造半导体器件或类似器件的步骤过程中不会发生变化，并且该粘接剂随后可在室温温和条件下轻松脱粘；以及一种使用该临时粘接剂制造半导体器件的方法。 本发明是一种临时粘接粘合剂，其特征在于它是一种聚酰亚胺共聚物，至少具有酸性二酐残基和二胺残基，二胺残基包括(A1)由通式(1)表示的聚硅氧烷基二胺残基中的两种，通式(1)中的n是1至15的自然数，和(B1)由通式(1)表示的聚硅氧烷基二胺残基中的两种，通式(1)中的n是16至100的自然数，聚酰亚胺共聚物含有40-99.99摩尔％的(A1)残基和0.01-60摩尔％的(B1)残基。
• PREPREG
  申请人：Toray Industries, Inc.

  公开号：EP3842481A1

  公开（公告）日：2021-06-30

  The invention aims to provide a prepreg having high storage stability and serving suitably for producing components, such as structural members and interior members of aircraft and structural members of aircraft engines, that require high heat resistance under high temperature, high humidity conditions, good physical properties, and good combustion properties. The prepreg is produced by impregnating the component [A] specified below with an epoxy resin composition containing the components [B] to [D] specified below, wherein the component [A] in the prepreg accounts for 50 mass% or more: [A] carbon fiber, [B] epoxy resin, [C] fluorene type curing agent having a maximum particle size of 100 µm or less, and [D] thermoplastic resin.

  本发明的目的是提供一种具有高储存稳定性的预浸料，该预浸料适用于生产要求在高温、高湿条件下具有高耐热性、良好物理性能和良好燃烧性能的部件，如飞机的结构件和内部构件以及飞机发动机的结构件。该预浸料是通过将下述组分[A]与含有下述组分[B]至[D]的环氧树脂组合物浸渍而制成的，其中预浸料中的组分[A]占 50% 或以上：[A]碳纤维，[B]环氧树脂，[C]最大粒径不超过 100 微米的芴类固化剂，以及[D]热塑性树脂。
• Polyimide resin, resin composition using same, and laminated film
  申请人：Toray Industries, Inc.

  公开号：US10026637B2

  公开（公告）日：2018-07-17

  A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.

  一种聚酰亚胺树脂包括酸酐残留物；和二胺残留物，该聚酰亚胺树脂包括由式（1）代表的聚硅氧烷二胺残留物，其含量不低于二胺残留物总量的 60%（以摩尔计）： 其中，n 为自然数，根据聚硅氧烷二胺的平均分子量计算的平均值为 45 至 200；R1 和 R2 相同或不同，各自代表具有 1 至 30 个碳原子的亚烷基或亚苯基；R3 至 R6 相同或不同，各自代表具有 1 至 30 个碳原子的烷基、苯基或苯氧基。