2-benzyl-5-(phenylethynyl)isoindoline-1,3-dione | 1054472-16-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 异吲哚及其衍生物
• 英文名称: 2-benzyl-5-(phenylethynyl)isoindoline-1,3-dione
• 英文别名: 2-Benzyl-5-(2-phenylethynyl)isoindole-1,3-dione；2-benzyl-5-(2-phenylethynyl)isoindole-1,3-dione
• CAS: 1054472-16-0
• 化学式: C₂₃H₁₅NO₂
• 分子量: 337.378
• InChiKey: QKGZXUGOZLTDPW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.88
• 重原子数：
  26.0
• 可旋转键数：
  2.0
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  37.38
• 氢给体数：
  0.0
• 氢受体数：
  2.0

反应信息

• 作为产物：
  描述：

  2-苄基-5-溴-1H-异吲哚-1,3(2H)-二酮 、 苯乙炔 在 bis-triphenylphosphine-palladium(II) chloride 、 copper(l) iodide 、 三乙胺 作用下， 反应 24.0h， 以86%的产率得到2-benzyl-5-(phenylethynyl)isoindoline-1,3-dione
  参考文献：
  名称：

  钯催化邻卤苯甲酸酯和伯胺的羰基环化一步合成异吲哚-1,3-二酮。

  摘要：

  邻卤代苯甲酸酯的钯催化氨基羰基化反应以良好的收率生成 2-取代的异吲哚-1,3-二酮。该方法为这一类重要的杂环化合物提供了一种良好的一步法，并且可以耐受多种官能团，包括甲氧基、醇、酮和硝基。

  DOI：

  10.1021/jo800936h

文献信息

• Curable compound
  申请人：DAICEL CORPORATION

  公开号：US11021438B2

  公开（公告）日：2021-06-01

  There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), R1 and R2 each represent a curable functional group; D1 and D2 each represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar1 to Ar3 each represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents —CO—, —S— or —SO2—; each Y represents —S—, —SO2—, —O—, —CO—, —COO— or —CONH—; and n represents an integer of 0 or more):

  本发明提供了一种固化化合物，它具有良好的溶剂溶解性，能够形成具有超耐热性的固化材料。根据本发明的可固化化合物由下式（1）表示。在式 (1) 中，R1 和 R2 分别代表可固化官能团；D1 和 D2 分别代表单键或连接基团；L 代表具有重复单元的二价基团，该重复单元包含下式 (I) 所代表的结构和下式 (II) 所代表的结构（其中 Ar1 至 Ar3 分别代表从芳香环的结构式中消除两个氢原子而成的基团，或从两个或多个芳香环通过单键或连接基团结合的结构式中消除两个氢原子而成的基团；X代表-CO-、-S-或-SO2-；每个Y代表-S-、-SO2-、-O-、-CO-、-COO-或-CONH-；n代表0或0以上的整数）：
• CURABLE COMPOUND
  申请人：DAICEL CORPORATION

  公开号：US20210253527A1

  公开（公告）日：2021-08-19

  Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T d5 ) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.