9,9-bis[3,5-dimethyl-4-(2,3-epoxypropoxy)phenyl]fluorene | 114205-90-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 9,9-bis[3,5-dimethyl-4-(2,3-epoxypropoxy)phenyl]fluorene
• 英文别名: 2-[[4-[9-[3,5-Dimethyl-4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]-2,6-dimethylphenoxy]methyl]oxirane
• CAS: 114205-90-2
• 化学式: C₃₅H₃₄O₄
• 分子量: 518.653
• InChiKey: OCOLKPHPPUVUMZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.5
• 重原子数：
  39
• 可旋转键数：
  8
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• AROMATIC AMINE COMPOUND, CURING AGENT FOR EPOXY COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING AROMATIC AMINE COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20210130284A1

  公开（公告）日：2021-05-06

  An aromatic amine compound capable of satisfactorily forming a cured product having exceptional alkali resistance by reaction with an epoxy compound; a curing agent for an epoxy compound, the curing agent including the aromatic amine compound; a curable composition including the curing agent for an epoxy compound; a cured product of the curable composition; a method for producing the cured product; and a method for producing the abovementioned aromatic amine compound. The aromatic amine compound has a structure such that a specific position in a central skeleton comprising a fused ring such as a fluorene ring is substituted with a side-chain group including two aromatic groups linked by a flexible bond such as an amide bond, at least one amino group is bonded to the end of the side-chain group, and the structure has no hydroxyl groups.

  一种芳香胺化合物，通过与环氧化合物反应能够满意地形成具有异常碱性抗性的固化产品；一种环氧化合物的固化剂，该固化剂包括芳香胺化合物；一种包括环氧化合物的固化剂的可固化组合物；可固化组合物的固化产品；生产所述固化产品的方法；以及生产上述芳香胺化合物的方法。该芳香胺化合物具有这样的结构，即中心骨架中的特定位置包括类似于芴环的融合环，该位置被取代为包括通过柔性键（如酰胺键）连接的两个芳香基的侧链基团，至少一个氨基固定在侧链基团的末端，并且该结构不含羟基。
• EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USES THEREOF
  申请人：KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

  公开号：US20140179836A1

  公开（公告）日：2014-06-26

  Disclosed are an epoxy compound having an alkoxysilyl group, a composite of which exhibits good heat resistant properties and/or a cured product of which exhibits good flame retardant properties, a method of preparing the same, a composition comprising the same, and a cured product and a use of the composition. An alkoxysilylated epoxy compound comprising at least one of Chemical Formula S1 substituent and at least two epoxy groups in a core, a method of preparing the epoxy compound by an allylation, a claisen rearrangement, an epoxidation and an alkoxysilylation, an epoxy composition comprising the epoxy compound, and a cured product and a use of the composition are provided. The composite of the disclosed exhibits improved chemical bonding, good heat resistant properties, a low CTE, a high glass transition temperature or Tg-less The cured product of the composition exhibits good flame retardant properties.

  揭示了一种具有烷氧基硅基团的环氧化合物，其复合材料具有良好的耐热性能和/或其固化产物具有良好的阻燃性能，以及其制备方法，包括该化合物的组合物，固化产物和组合物的用途。所述的烷氧基硅化环氧化合物包括至少一种化学式S1取代基和至少两个环氧基团在核心中，通过烯丙基化、克莱森重排、环氧化和烷氧基硅化制备环氧化合物的方法，包括该环氧化合物的环氧组合物，固化产物和组合物的用途。所述的复合材料具有改善的化学键合、良好的耐热性能、低CTE、高玻璃转变温度或Tg-less。该组合物的固化产物具有良好的阻燃性能。
• COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
  申请人：KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

  公开号：US20150148452A1

  公开（公告）日：2015-05-28

  There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.

  提供一种包括烷氧硅基化环氧化合物的组合物，该组合物的性质具有良好的耐热性能，低CTE和高玻璃转变温度或Tg-无需单独的偶联剂，并且包括无机颗粒，所述组合物形成的固化产物，以及所述固化产物的用途。提供一种包括烷氧硅基化环氧化合物和无机颗粒的环氧组合物，一种包括环氧化合物、无机颗粒和固化剂的环氧组合物，所述组合物的固化产物，以及所述组合物的用途。由于烷氧硅基团与无机颗粒之间以及烷氧硅基团之间可能形成化学键，因此包括烷氧硅基化环氧化合物和无机颗粒的组合物具有改善的耐热性能、降低的CTE和增加的玻璃转变温度或Tg less。
• Glycidylethers of fluorene-containing bisphenols
  申请人：MINNESOTA MINING AND MANUFACTURING COMPANY

  公开号：EP0274209A1

  公开（公告）日：1988-07-13

  Diglycidyl ethers of ortho-substituted­4-hydroxyphenylfluorenes, curable compositions comprising the diglycidyl ethers, and cured resins thereof have a high glass transition and an improved modulus of elasticity. The diglycidyl ethers of the invention for use in the curable composition of the invention can be mixtures obtained by the reaction of epihalohydrin with mixtures of fluorenebisphenols obtained by the reaction of one mole of one or more fluorenones with two or more moles or mixtures of two or more ortho-substituted phenols. The compositions are useful in molding and coating applications and in composite articles where the operating temperature of the article or material is elevated.

  原代-4-羟基苯基芴的二缩水甘油醚、包含该二缩水甘油醚的可固化组合物及其固化树脂具有较高的玻璃化转变和更好的弹性模量。 用于本发明可固化组合物的本发明二缩水甘油醚可以是由表卤代烃与由一摩尔的一种或多种芴酮与两种或多种原代苯酚或两种或多种原代苯酚的混合物反应得到的芴双酚的混合物。 该组合物适用于模塑和涂层应用，以及物品或材料工作温度较高的复合物品。
• INSULATING SHEET AND LAMINATED STRUCTURE
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2316897A1

  公开（公告）日：2011-05-04

  The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

  本发明提供了一种绝缘片材，它在未固化时具有极佳的可操作性，可防止在层压机中过度流动，并可提供具有极佳的介电击穿特性、导热性、耐热性和可加工性的固化产品。用于将导热系数为 10 W/m-K 或更高的热导体与导电层粘合的绝缘片材，包括(A) 具有 10,000 或以上重量平均分子量的聚合物；(B) 具有芳香族骨架且重量平均分子量为 600 或以下的环氧单体 (B1) 和具有芳香族骨架且重量平均分子量为 600 或以下的氧杂环丁烷单体 (B2) 中的至少一种；(C) 固化剂；(D) 20-60%（体积）的第一种无机填料；以及 (E) 1-40%（体积）的有机填料（E1）和第二种无机填料（E2）中的至少一种，第二种无机填料与第一种无机填料（D）不同，其新莫氏硬度为 3 或更低；当填料（E）包含有机填料（E1）时，有机填料（E1）的比例为 3-40%（体积）。