1,1-Bis-phthalimido-ethan | 2390-35-4

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 异吲哚及其衍生物
• 英文名称: 1,1-Bis-phthalimido-ethan
• 英文别名: N,N'-ethane-1,1-diyl-bis-phthalimide；2-[1-(1,3-Dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione
• CAS: 2390-35-4
• 化学式: C₁₈H₁₂N₂O₄
• 分子量: 320.304
• InChiKey: VMDUCBGGRQJKBV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.1
• 重原子数：
  24
• 可旋转键数：
  2
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.11
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• [EN] STING AGONISTS AND USES THEREOF<br/>[FR] AGONISTES DE STING ET LEURS UTILISATIONS
  申请人：NIMBUS TITAN INC

  公开号：WO2020132582A1

  公开（公告）日：2020-06-25

  The present invention provides compounds, compositions thereof, and methods of using the same for the modulation of STING, and the treatment of STING-mediated disorders.

  本发明提供了化合物、其组合物以及使用这些化合物调节STING并治疗STING介导的疾病的方法。
• Method for preparing n-($g(v)-bromoalkyl)phthalimides
  申请人：——

  公开号：US20040176613A1

  公开（公告）日：2004-09-09

  The invention concerns a procedure for preparation of N-(&ohgr;-bromoalkyl)phthalimides which consists of reacting potassium phthalimide with an &agr;,&ohgr;-dibromoalkane without cosolvent, at a temperature from 50° C. to 130° C. by using a molar ratio of &agr;,&ohgr;-dibromoalkane to potassium phthalimide from 3 to 8, of cooling the reaction medium to about 80° C.-85° C., of washing it with water, of decanting, of removing excess &agr;,&ohgr;-dibromoalkane from the organic phase under reduced pressure, and then of crystallizing the N-(&ohgr;-bromoalkyl)phthalimide with a low boiling point alcohol.

  该发明涉及一种制备N-(&ohgr;-溴代烷基)邻苯二甲酰亚胺的方法，包括在无共溶剂的情况下，将苯甲酰亚胺钾与α，&ohgr;-二溴代烷烃反应，反应温度为50°C至130°C，使用α，&ohgr;-二溴代烷烃与苯甲酰亚胺钾的摩尔比为3至8，将反应介质冷却至约80°C-85°C，用水洗涤，倾析，将过量的α，&ohgr;-二溴代烷烃在减压下从有机相中去除，然后用低沸点醇结晶N-(&ohgr;-溴代烷基)邻苯二甲酰亚胺。
• PROCEDE DE PREPARATION DE N-(OMEGA-BROMOALKYL)PHTALIMIDES
  申请人：Albemarle Chemicals SAS

  公开号：EP1436261A1

  公开（公告）日：2004-07-14
• Electronic Components
  申请人：Cupta W. Glenn

  公开号：US20070276100A1

  公开（公告）日：2007-11-29

  The invention relates to an electronic component components made from a polymer composition comprising at least 70 weight % with respect to the total weight of the composition of at least one high glass transition sulfone polymer, to a method of manufacturing said electronic component and to an electronic assembly comprising said component. Electronic components, especially substrates, made from this polymer composition exhibit high HDT, low moisture pick-up, and isotropic strength and toughness properties necessary to survive the high temperature lead-free soldering operations used in circuit board and flex circuit assembly techniques.
• Flame resistance natural fiber-filled thermoplastics with improved properties
  申请人：Goode Michael J.

  公开号：US20080073627A1

  公开（公告）日：2008-03-27

  The invention relates to flame retardant systems including the brominated flame retardants and chlorinated flame retardants with synergists and char formers for use in wood-filled resins in combination with compatibilizers to enhance physical properties and to increase water extraction resistance and long term durability. Desirable embodiments of the invention relate to brominated and chlorinated flame retardant additives, synergists, and char formers for use in resins, including polyolefins, fillers, wood-filled polyolefins, in combination with compatibilizers and methods of use of the flame retardants and fillers. The invention includes methods of making and using the composition.