申请人:Amgen, Inc
公开号:EP2270006A1
公开(公告)日:2011-01-05
Compounds having the general structure and compositions containing them, for the treatment of acute, inflammatory and neuropathic pain, dental pain, general headache, migraine, cluster headache, mixed-vascular and non-vascular syndromes, tension headache, general inflammation, arthritis, rheumatic diseases, osteoarthritis, inflammatory bowel disorders, inflammatory eye disorders, inflammatory or unstable bladder disorders, psoriasis, skin complaints with inflammatory components, chronic inflammatory conditions, inflammatory pain and associated hyperalgesia and allodynia, neuropathic pain and associated hyperalgesia and allodynia, diabetic neuropathy pain, causalgia, sympathetically maintained pain, deafferentation syndromes, asthma, epithelial tissue damage or dysfunction, herpes simplex, disturbances of visceral motility at respiratory, genitourinary, gastrointestinal or vascular regions, wounds, burns, allergic skin reactions, pruritus, vitiligo, general gastrointestinal disorders, gastric ulceration, duodenal ulcers, diarrhea, gastric lesions induced by necrotising agents, hair growth, vasomotor or allergic rhinitis, bronchial disorders or bladder disorders.
or any pharmaceutically-acceptable salt thereof, wherein:
J is O or S;
X is = C(R2);
Y is N;
具有一般结构的化合物和含有这些化合物的组合物,用于治疗急性、炎症性和神经性疼痛、牙痛、一般头痛、偏头痛、丛集性头痛、混合血管性和非血管性综合征、紧张性头痛、一般炎症、关节炎、风湿性疾病、骨关节炎、炎症性肠道疾病、炎症性眼部疾病、炎症性或不稳定的膀胱疾病、银屑病、含有炎症成分的皮肤不适、慢性炎症、炎症性疼痛及相关的痛觉减退和痛觉过敏、神经性疼痛及相关的痛觉减退和痛觉过敏、糖尿病神经病变性疼痛、因痛症、交感神经维持性疼痛、去感觉综合征、哮喘、上皮组织损伤或功能障碍、单纯疱疹、呼吸道、泌尿生殖道、胃肠道或血管内脏运动障碍、伤口、烧伤、皮肤过敏反应、瘙痒症、白癜风、一般胃肠道疾病、胃溃疡、十二指肠溃疡、腹泻、坏死剂引起的胃部病变、毛发生长、血管运动性或过敏性鼻炎、支气管疾病或膀胱疾病。
或其任何药学上可接受的盐,其中
J 是 O 或 S;
X 是 = C(R2)
Y 是 N;