6-Hydroxy-5-methoxy-N-methylphthalimide

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 异吲哚及其衍生物
• 英文名称: 6-Hydroxy-5-methoxy-N-methylphthalimide
• 英文别名: 5-hydroxy-6-methoxy-2-methylisoindole-1,3-dione
• 化学式: C₁₀H₉NO₄
• 分子量: 207.18
• InChiKey: STQUCJZSEVAMPY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.5
• 重原子数：
  15
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  66.8
• 氢给体数：
  1
• 氢受体数：
  4

文献信息

• MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3985439A1

  公开（公告）日：2022-04-20

  The present invention is a material for forming an organic film, containing: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, where W1 represents a tetravalent organic group, n1 represents an integer of 0 or 1, n2 represents an integer of 1 to 3, and R1 represents any one or more of the following general formulae (1B). This provides an imide compound, where the compound is cured not only under air, but also under film formation conditions of inert gas, and can form an organic underlayer film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film formation and adhesion to a substrate, and a material for forming an organic film containing the compound.

  本发明是一种用于形成有机薄膜的材料，包含：(A)由以下通式(1A)所示的用于形成有机薄膜的化合物；和(B)有机溶剂，其中 W1 代表四价有机基团，n1 代表 0 或 1 的整数，n2 代表 1 至 3 的整数，R1 代表以下通式(1B)中的任意一个或多个。本发明提供了一种亚胺化合物，该化合物不仅可在空气中固化，还可在惰性气体的成膜条件下固化，并可形成有机底层膜，该膜不仅具有优异的耐热性和填充基底上形成的图案并使其平面化的特性，还具有良好的成膜性和与基底的粘附性，同时还提供了一种用于形成含有该化合物的有机膜的材料。

表征谱图