RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE
申请人:Wada Masahiro
公开号:US20130289187A1
公开(公告)日:2013-10-31
A resin composition for encapsulation according to the present invention includes: a phenol resin-based curing agent (A) essentially containing a polymer component (A-1) in which a biphenylene group-containing structural unit bonds a monovalent hydroxyphenylene structural unit and a polyvalent hydroxyphenylene structural unit together and a polymer component (A-2) in which the biphenylene group-containing structural unit bonds the polyvalent hydroxyphenylene structural units together; an epoxy resin (B); and an inorganic filler (C). This makes it possible to economically obtain a resin composition for encapsulation having soldering resistance, flame resistance, continuous moldability, flowability and high temperature storage stability in an excellent balanced manner, and an electronic component device produced by encapsulating an element with a cured product thereof and having high reliability.
US3996175A
申请人:——
公开号:US3996175A
公开(公告)日:1976-12-07
US4256844A
申请人:——
公开号:US4256844A
公开(公告)日:1981-03-17
Synthesis of High-<i>T</i><sub>g</sub> Nonisocyanate Polyurethanes via Reactive Extrusion and Their Batch Foaming
作者:Arpan Datta Sarma、Sergei V. Zubkevich、Frédéric Addiego、Daniel F. Schmidt、Alexander S. Shaplov、Vincent Berthé
DOI:10.1021/acs.macromol.4c00222
日期:2024.4.9
a series of cyclic carbonate monomers were synthesized; in particular, a BPA-based bis(cyclic carbonate) was prepared from the commercial bis(epoxide), while two additional bis(cyclic carbonates) were prepared from the relevant bisphenols via sequential epoxidation and carbonation with CO2. Spectroscopic analyses confirm the successful synthesis of high-purity monomers. Second, PHUs were prepared via