申请人:WAKO PURE CHEMICAL INDUSTRIES, LTD.
公开号:US20020016272A1
公开(公告)日:2002-02-07
This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same.
The said cleaning agent and the method have made it possible to control a speed of etching on silicone oxide so as to remove impurities adsorbed on copper wirings and silicone oxide on a surface of a semi-conductor substrate having copper wirings on its surface, such as copper oxides and particles, without causing corrosion or oxidation of copper wirings nor causing roughness on the surface.
本发明涉及一种用于半导体衬底,特别是表面有铜线的衬底的清洗剂,包括一种非离子表面活性剂和一种清洗方法。
上述清洗剂和方法可以控制对氧化硅的蚀刻速度,从而去除吸附在表面有铜线的半导体基板表面的铜线和氧化硅上的杂质,如铜氧化物和颗粒,而不会造成铜线的腐蚀或氧化,也不会造成表面粗糙。