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5,8-Dihydroxynaphthalene-2-carbaldehyde | 1005001-38-6

中文名称
——
中文别名
——
英文名称
5,8-Dihydroxynaphthalene-2-carbaldehyde
英文别名
5,8-dihydroxynaphthalene-2-carbaldehyde
5,8-Dihydroxynaphthalene-2-carbaldehyde化学式
CAS
1005001-38-6
化学式
C11H8O3
mdl
——
分子量
188.183
InChiKey
ZBNWVIKQUJCMBQ-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.9
  • 重原子数:
    14
  • 可旋转键数:
    1
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    57.5
  • 氢给体数:
    2
  • 氢受体数:
    3

上下游信息

  • 下游产品
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

  • 作为反应物:
    描述:
    参考文献:
    名称:
    并五苯中间体通过 6,13-​​并五苯醌在水溶液中的正式分子内光氧化还原
    摘要:
    我们实验室发现的芳香酮在水溶液中的正式分子内光氧化还原反应(或串联光互变异构化)已扩展到许多苯醌。特别是,我们对光氧化还原反应是否可以应用于 2-(羟甲基)-6,13-​​并五苯醌 (4) 感兴趣,这将产生 2-甲酰基-6,13-​​二羟基并五苯 (10),从而提供一种合成并五苯衍生物的光化学方法。虽然许多苯并苯醌表现出一系列的光氧化还原反应性,但 4 在酸性水溶液(pH < 3)中的光解导致分子内光氧化还原反应,通过烯醇中间体,产生 10(绿色化合物;Φ ~ 0.2,pH 1 ),它的反应性太强,无法通过标准的 ArOH 捕集剂(如乙酸酐)进行分离或捕集。
    DOI:
    10.1139/v07-117
  • 作为产物:
    描述:
    参考文献:
    名称:
    并五苯中间体通过 6,13-​​并五苯醌在水溶液中的正式分子内光氧化还原
    摘要:
    我们实验室发现的芳香酮在水溶液中的正式分子内光氧化还原反应(或串联光互变异构化)已扩展到许多苯醌。特别是,我们对光氧化还原反应是否可以应用于 2-(羟甲基)-6,13-​​并五苯醌 (4) 感兴趣,这将产生 2-甲酰基-6,13-​​二羟基并五苯 (10),从而提供一种合成并五苯衍生物的光化学方法。虽然许多苯并苯醌表现出一系列的光氧化还原反应性,但 4 在酸性水溶液(pH < 3)中的光解导致分子内光氧化还原反应,通过烯醇中间体,产生 10(绿色化合物;Φ ~ 0.2,pH 1 ),它的反应性太强,无法通过标准的 ArOH 捕集剂(如乙酸酐)进行分离或捕集。
    DOI:
    10.1139/v07-117
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文献信息

  • Resist underlayer film composition and patterning process using the same
    申请人:Shin-Etsu Chemical Co., Ltd.
    公开号:EP2476713A1
    公开(公告)日:2012-07-18
    There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.
    本发明公开了一种抗蚀剂底层薄膜组合物,其中该组合物含有至少由以下通式(1-1)和/或(1-2)表示的一种或多种化合物和以下通式(2-1)和/或(2-2)表示的一种或多种化合物和/或其等效体缩合而得的聚合物。可以提供一种底层膜组合物,特别是用于三层抗蚀工艺的底层膜组合物,该组合物可以形成反射率降低的底层膜(即作为抗反射膜具有最佳 n 值和 k 值的底层膜)、填充性能优异、图案抗弯曲性能高、蚀刻后尤其是在厚度小于 60 nm 的高纵横向线上不会出现掉线或晃动的底层膜,以及使用该底层膜组合物的图案化工艺。
  • RESIST UNDERLAYER FILM COMPOSITION AND PATTERNING PROCESS USING THE SAME
    申请人:OGIHARA Tsutomu
    公开号:US20120184103A1
    公开(公告)日:2012-07-19
    There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.
  • RESIST OVERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
    公开号:US20150248057A1
    公开(公告)日:2015-09-03
    A resist overlayer film forming composition that is used for a lithography process for manufacturing semiconductor devices, and selectively transmits EUV only, in particular, by blocking exposure light undesirable for EUV exposure, such as UV and DUV, without intermixing with a resist, and that can be developed with a developing solution after exposure. A resist overlayer film forming composition including: a hydroxyl group-containing novolac-based polymer containing a structure of (Formula 1-1): (in (Formula 1-1), Ar 1 is a divalent organic group that contains 1 to 3 benzene ring(s) and optionally contains a hydroxy group; Ar 2 is a benzene ring group, a naphthalene ring group, or an anthracene ring group; each of the hydroxy group and R 1 is a substituent for a hydrogen atom on a ring of Ar 2 ); and a solvent.
  • US8853031B2
    申请人:——
    公开号:US8853031B2
    公开(公告)日:2014-10-07
  • US9494864B2
    申请人:——
    公开号:US9494864B2
    公开(公告)日:2016-11-15
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