ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
申请人:Samsung Electronics Co., Ltd.
公开号:US20200207790A1
公开(公告)日:2020-07-02
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
提供了一种铝化合物以及使用它制造半导体器件的方法。该铝化合物可用公式1表示。
Combes,A.; Combes,C., Bulletin de la Societe Chimique de France, 1892, vol. <3> 7, p. 791
作者:Combes,A.、Combes,C.
DOI:——
日期:——
Kazitsyna,L.A. et al., Journal of general chemistry of the USSR, 1961, vol. 31, p. 286 - 294