CATIONICALLY POLYMERIZABLE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
申请人:Funaki Yoshinori
公开号:US20120077946A1
公开(公告)日:2012-03-29
Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0° C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein R
x
represents hydrogen atom or methyl group; R
1
to R
3
each independently represent a hydrocarbon group having 1 to 5 carbon atoms; “a” is an integer of from 0 to 5; and “b” is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment.
CATION-POLYMERIZABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
申请人:Yoshida Tsukasa
公开号:US20120027342A1
公开(公告)日:2012-02-02
Provided is a cationically polymerizable resin composition which has a low viscosity, is easy to work, and is extremely rapidly cured upon irradiation with light to give a cured product excellent in optical transparency, flexibility, thermal stability, and post-heating bendability.
The cationically polymerizable resin composition includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-group-containing vinyl ether compound (B); an oligomer or polymer (C) containing, in the molecule, at least one selected from oxetane group, epoxy group, hydroxyl group, vinyl ether group, and an aliphatic or alicyclic unsaturated hydrocarbon group and having a molecular weight of 500 or more; and an oxetane compound (D) containing no vinyl ether group and having 6 or more carbon atoms.
Cationically polymerizable resin composition and cured object obtained therefrom
申请人:Funaki Yoshinori
公开号:US08975349B2
公开(公告)日:2015-03-10
Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0° C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rx represents hydrogen atom or methyl group; R1 to R3 each independently represent a hydrocarbon group having 1 to 5 carbon atoms; “a” is an integer of from 0 to 5; and “b” is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment.
CURABLE COMPOSITION, CURED PRODUCT THEREOF, OPTICAL MEMBER AND OPTICAL DEVICE
申请人:DAICEL CORPORATION
公开号:US20150212300A1
公开(公告)日:2015-07-30
An object of the present invention is to provide a curable composition that can be cured satisfactorily and can form a cured product having a high glass transition temperature as maintained and having high mechanical strength. A curable composition includes a siloxane (A), a cycloaliphatic epoxide (B), and a curing agent (C). The siloxane (A) contains at least two epoxy groups per molecule. The cycloaliphatic epoxide (B) in the curable composition is preferably a compound represented by Formula (I):
wherein X is selected from a single bond and a linkage group.
CURABLE EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, DIOLEFIN COMPOUND AND PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR DIEPOXY COMPOUND
申请人:DAICEL CORPORATION
公开号:US20160122466A1
公开(公告)日:2016-05-05
An object of the present invention is to provide a curable epoxy resin composition, which is cured to provide a cured product having a high glass-transition temperature and particularly having excellent balance between heat resistance and transparency.
The present invention relates to a curable epoxy resin composition comprising an alicyclic epoxy compound (A) represented by the following formula (1) and a curing agent (B), or a curable epoxy resin composition comprising an alicyclic epoxy compound (A) represented by the following formula (1) and a curing catalyst (C).
wherein R
1
to R
22
, which may be the same or different, each represent a hydrogen atom, a methyl group or an ethyl group; and m and n, which may be the same or different, each represent an integer of 1 to 4.