2,4-dioxa-bicyclo[3.3.1]nonan-3-one | 4389-23-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 二恶烷
• 英文名称: 2,4-dioxa-bicyclo[3.3.1]nonan-3-one
• 英文别名: 2,4-Dioxa-bicyclo[3.3.1]nonan-3-on；Cyclohexan-1,3-carbonat；2,4-Dioxabicyclo[3.3.1]nonan-3-one
• CAS: 4389-23-5
• 化学式: C₇H₁₀O₃
• 分子量: 142.155
• InChiKey: RFYCGFULCNYWQH-UHFFFAOYSA-N

物化性质

• 沸点：
  298.8±9.0 °C(Predicted)
• 密度：
  1.191±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.6
• 重原子数：
  10
• 可旋转键数：
  0
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  2,4-dioxa-bicyclo[3.3.1]nonan-3-one 、 2,5-二氯苯磺酸 生成 1,4-环己二烯 、 水 、 1,3-环己二烯 、 methylammonium carbonate
  参考文献：
  名称：

  Polymerization and Ring Strain in Bridged Bicyclic Compounds

  摘要：

  DOI：

  10.1021/ja01556a061
• 作为产物：
  描述：

  cis-1,3-cyclohexanediol 、 碳酸二乙酯 在 potassium carbonate 作用下， 生成 2,4-dioxa-bicyclo[3.3.1]nonan-3-one
  参考文献：
  名称：

  Polymerization and Ring Strain in Bridged Bicyclic Compounds

  摘要：

  DOI：

  10.1021/ja01556a061

文献信息

• TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME
  申请人：Sumitomo Bakelite Company Limited

  公开号：EP2351804A1

  公开（公告）日：2011-08-03

  To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

  提供一种用于半导体晶片的临时粘接剂，该粘接剂可减少对半导体晶片的损坏，使其易于分离，并可缩短热分解所需的时间，以及使用该粘接剂的半导体器件的制造方法。 一种半导体晶片用临时粘接剂，是一种临时粘接剂，用于在加工半导体晶片时将半导体晶片临时粘接在支撑基板上，以及在加工后通过加热将半导体晶片从支撑基板上分离，该粘接剂含有一种树脂成分组合物，其50%失重温度在接受活性能量射线照射后会降低。
• USE OF A RESIN COMPOSITION AS A TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME
  申请人：Sumitomo Bakelite Company Limited

  公开号：EP2351804B1

  公开（公告）日：2014-12-10
• TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Takeuchi Etsu

  公开号：US20110318938A1

  公开（公告）日：2011-12-29

  To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.
• US9399725B2
  申请人：——

  公开号：US9399725B2

  公开（公告）日：2016-07-26
• Polymerization and Ring Strain in Bridged Bicyclic Compounds
  作者：H. K. Hall

  DOI：10.1021/ja01556a061

  日期：1958.12