申请人:LG Chem, Ltd.
公开号:US20210234111A1
公开(公告)日:2021-07-29
The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.