PROCESSES FOR PREPARING CURED FILMS, THE RESULTING FILMS, AND PLASMA-INITIATED POLYMERIZABLE COMPOSITIONS
                        
                            
                                申请人:FUJIFILM Corporation
                            
                            
                                公开号:US20140170405A1
                            
                            
                                公开(公告)日:2014-06-19
                            
                            Provided are novel plasma-assisted processes for preparing cured films having excellent heat resistance and moisture resistance.
A process for preparing a cured film, comprising at least: applying a composition containing (A) at least one conductive polymer precursor on a substrate to form a coating layer, and irradiating the coating layer with a plasma to polymerize the conductive polymer precursor (A).
                            提供了一种新型等离子体辅助制备固化膜的工艺,该固化膜具有优异的耐热性和耐潮性。一种制备固化膜的工艺,包括至少以下步骤:在基板上涂布含有(A)至少一种导电聚合物前体的组合物以形成涂层层,然后用等离子体照射涂层层以聚合导电聚合物前体(A)。