9-(4-Aminophenyl)-9-phenylfluoren-3-amine

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 9-(4-Aminophenyl)-9-phenylfluoren-3-amine
• 英文别名: 9-(4-aminophenyl)-9-phenylfluoren-3-amine
• 化学式: C₂₅H₂₀N₂
• 分子量: 348.4
• InChiKey: UMVPZZVDSLEPDE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.3
• 重原子数：
  27
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  52
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• Polyimides, coating composition formed therefrom and use thereof
  申请人：Eternal Materials Co., Ltd.

  公开号：US10280334B2

  公开（公告）日：2019-05-07

  A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.

  提供了一种聚酰亚胺（PI），其两端各有两个-COOH封端基团。本发明还提供了一种涂层组合物，其中包含 PI 和一种具有 2 至 6 个能与 -COOH 反应的官能团的硬化剂。由本发明的涂层组合物形成的 PI 涂层和 PI 薄膜具有优异的耐化学性和热膨胀系数（CTE），因此适用于制造有源/无源器件的保护材料、光学材料、触摸面板、铜箔基板、软挠性电子材料或集成电路元件，或玻璃薄膜触摸面板的薄膜基板。
• Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same
  申请人：ETERNAL MATERIALS CO., LTD.

  公开号：US10765008B2

  公开（公告）日：2020-09-01

  The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

  本公开提供了一种金属包覆层压板、其制备方法以及使用其制备柔性电路板的方法。本公开的金属包覆层压板包括第一金属箔、直接设置在第一金属箔上的第一聚酰亚胺层、第二金属箔和直接设置在第二金属箔上的第二聚酰亚胺层，第一聚酰亚胺层与第二聚酰亚胺层接触。本公开的金属覆铜箔层压板在结构上等同于双面柔性覆铜箔层压板（FCCL），在减少翘曲的机械性能方面优于单面 FCCL，并且具有可在其两面同时用于电路制造的优点。
• POLYIMIDES, COATING COMPOSITION FORMED THEREFROM AND USE THEREOF
  申请人：Eternal Chemical Co., Ltd.

  公开号：US20140228512A1

  公开（公告）日：2014-08-14

  A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.
• METAL CLAD LAMINATE, PREPARATION METHOD THEREOF, AND METHOD FOR PREPARING FLEXIBLE CIRCUIT BOARD BY USING THE SAME
  申请人：ETERNAL MATERIALS CO., LTD.

  公开号：US20160374208A1

  公开（公告）日：2016-12-22

  The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.