A first damping material composition comprises (a-1) an epoxy resin, (b) a curing agent, and (c-1) a liquid polymer having in one molecule on the average 1.6 or more of at least one functional group selected from among carboxyl, acid anhydride, amino, amido, and mercapto groups capable of reacting with epoxy groups of the epoxy resin and having a glass transition point of up to 0°C. A second damping material composition comprises (a-2) an epoxy resin of polyglycidyl ether with polyol or its polymer, (b) a curing agent, and (c-2) an aromatic hydrocarbon, a phenol or polymer containing at least one of them as main component and having a softening point of up to 25°C. A third damping material composition comprises (1) an epoxy resin obtained by adding (c-3) a cyclic ester to (a-3) a bisphenol type epoxy resin in a weight ratio of (c-3) to (a-3) of 20180 to 98/2, and (b) a curing agent. The equivalent ratio (b)/(I) of (I) said epoxy resin to (b) said curing agent is in the range of 0.6 to 1.4.
第一种阻尼材料组合物包括(a-1)环氧
树脂、(b)固化剂和(c-1)液态聚合物,该聚合物在一个分子中平均含有 1.6 个或更多的至少一个官能团,这些官能团选自羧基、酸酐、
氨基、胺基和巯基,能与环氧
树脂的环氧基团反应,且
玻璃化转变点不超过 0℃。第二种阻尼材料组合物包括:(a-2) 聚
缩水甘油醚环氧
树脂与多元醇或其聚合物;(b) 固化剂;(c-2) 芳香族碳氢化合物、
苯酚或至少含有其中一种作为主要成分的聚合物,其软化点最高可达 25°C。第三种阻尼材料组合物包括:(1) 一种环氧
树脂,将 (c-3) 环酯加入到 (a-3) 双
酚型环氧
树脂中,(c-3) 与 (a-3) 的重量比为 20180 至 98/2;(b) 一种固化剂。(I)所述环氧
树脂与(b)所述固化剂的当量比(b)/(I)在 0.6 至 1.4 之间。