9,9-bis(4-cyanatophenyl)fluorene | 32728-32-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 9,9-bis(4-cyanatophenyl)fluorene
• 英文别名: 9,9-Bis-(4-cyanatophenyl)-fluoren；[4-[9-(4-cyanatophenyl)fluoren-9-yl]phenyl] cyanate
• CAS: 32728-32-8
• 化学式: C₂₇H₁₆N₂O₂
• mdl: MFCD00224196
• 分子量: 400.436
• InChiKey: VUXPPEKXKWEBMC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.7
• 重原子数：
  31
• 可旋转键数：
  4
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  66
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• EPOXY RESIN, HARDENABLE RESIN COMPOSITION CONTAINING THE SAME AND USE THEREOF
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1852451A1

  公开（公告）日：2007-11-07

  It is an object of the present invention, with respect to a phenol aralkyl type epoxy resin, to suppress any crystal precipitation, improve the quality manageability and operation efficiency at composition production and enhance the properties, including heat resistance, thereof It is also intended to provide a resin composition that even when stored in the form of a varnish for a prolonged period of time, is resistant to crystal precipitation, excelling in storage stability and operation efficiency, and that gives a hardening product of low dielectric constant and low dielectric tangent excelling in heat resistance, water resistance and flame retardance. There is provided an epoxy resin characterized by comprising a phenol aralkyl type epoxy resin in which a content (an area % measured by gel permeation chromatography) of a bifunctional compound is 20% or less, and provided a resin composition obtained therefrom.

  本发明的目的是针对苯酚芳烷基型环氧树脂，抑制任何晶体析出，提高组合物生产的质量管理性和操作效率，并增强包括耐热性在内的各种性能、其目的还在于提供一种树脂组合物，该树脂组合物即使以清漆的形式长期储存，也能防止结晶析出，在储存稳定性和操作效率方面表现优异，并能提供低介电常数和低介电常数的硬化产品，在耐热性、耐水性和阻燃性方面表现优异。 本发明提供了一种环氧树脂，其特征在于该环氧树脂由酚芳基型环氧树脂组成，其中双官能团化合物的含量（用凝胶渗透色谱法测量的面积百分比）为 20% 或更少，并提供了由此获得的树脂组合物。
• RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：EP3252101A1

  公开（公告）日：2017-12-06

  The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): wherein n represents an integer of 1 or more; and an epoxy resin (B).

  本发明提供了一种用于印刷线路板的树脂组合物，该树脂组合物包含由以下通式（1）表示的氰酸酯化合物（A）： 其中 n 代表 1 或 1 以上的整数；以及环氧树脂 (B)。
• RESIN COMPOSITION, PREPREG, METAL FOIL-TIGHTENED LAMINATED SHEET, RESIN SHEET, AND PRINTED WIRING BOARD
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP3805293A1

  公开（公告）日：2021-04-14

  Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

  本发明提供了一种树脂组合物，该树脂组合物可以形成具有低介电常数和介电损耗正切、优异的耐碱性和抗剥落性的印刷线路板；以及使用该树脂组合物形成的预浸料、树脂片材、金属箔包覆层压板和印刷线路板。该树脂组合物包含苯乙烯基弹性体（A）、苯乙烯低聚物（B）、马来酰亚胺化合物（C）和氰酸酯化合物（D）。
• RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET AND PRINTED WIRING BOARD
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP3805316A1

  公开（公告）日：2021-04-14

  A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; -(Y-O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.

  一种树脂组合物含有马来酰亚胺化合物 (A)、氰酸酯化合物 (B)、平均分子量不低于 1000 但不高于 7000 且由式 (1) 表示的聚苯醚化合物 (C) 和具有苯乙烯骨架的嵌段共聚物 (D)。在式 (1) 中，X 代表芳基；-(Y-O)n2- 代表聚苯醚分子；R1、R2 和 R3 各自独立地代表氢原子、烷基、烯基或炔基；n2 代表 1 至 100 的整数；n1 代表 1 至 6 的整数；n3 代表 1 至 4 的整数。
• RESIN COMPOSITION, RESIN SHEET, PREPREG, AND PRINTED WIRING BOARD
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP4094940A1

  公开（公告）日：2022-11-30

  [Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength. [Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, -(Y-O)n2- represents a polyphenylene ether portion, R1, R2 and R3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n2 represents an integer of 1 to 100, n1 represents an integer of 1 to 6 and n3 represents an integer of 1 to 4.

  [问题]提供一种树脂组合物、树脂片材、预浸料和印刷线路板，该树脂组合物、树脂片材、预浸料和印刷线路板能够获得优异的低介电常数、低介电损耗正切、柔韧性和剥离强度。 [解决方法] 一种树脂组合物，其中含有 (A) 相对介电常数低于 2.7 的马来酰亚胺化合物，(B) 下文通式 (1) 所示的聚苯醚化合物，其数均分子量为 1000 至 7000，以及 (C) 以苯乙烯为骨架的嵌段共聚物。在通式（1）中，X 代表芳基，-(Y-O)n2- 代表聚苯醚部分，R1、R2 和 R3 各自独立地代表氢原子或烷基、烯基或炔基，n2 代表 1 至 100 的整数，n1 代表 1 至 6 的整数，n3 代表 1 至 4 的整数。