Aqueous buffered fluoride-containing etch residue removers and cleaners
申请人:——
公开号:US20040266637A1
公开(公告)日:2004-12-30
The invention relates to aqueous, buffered, fluoride containing compositions having a pH of greater than 7.0 to about 11.0. In certain embodiments, the buffered compositions have an extended worklife because pH dependent attributes such as oxide and metal etch rates are stable so long as the pH remains stable.
Aqueous Buffered Fluoride-Containing Etch Residue Removers and Cleaners
申请人:Rovito Roberto J.
公开号:US20110015108A1
公开(公告)日:2011-01-20
The invention relates to aqueous, buffered, fluoride containing compositions having a pH of greater than 7.0 to about 11.0. In certain embodiments, the buffered compositions have an extended worklife because pH dependent attributes such as oxide and metal etch rates are stable so long as the pH remains stable.