1-[4-[9-[4-(2,5-Dioxopyrrol-1-yl)phenyl]fluoren-9-yl]phenyl]pyrrole-2,5-dione

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 1-[4-[9-[4-(2,5-Dioxopyrrol-1-yl)phenyl]fluoren-9-yl]phenyl]pyrrole-2,5-dione
• 化学式: C₃₃H₂₀N₂O₄
• 分子量: 508.5
• InChiKey: BXPYZSVAHMLJJI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.9
• 重原子数：
  39
• 可旋转键数：
  4
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.03
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• THERMOSETTING RESIN COMPOSITION
  申请人：Showa Denko K.K.

  公开号：EP3239200A1

  公开（公告）日：2017-11-01

  Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m + n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

  本发明提供了一种热固性树脂组合物，该组合物在固化后能够获得高可靠性的固化产品，该产品具有优异的耐湿性、耐热性和机械强度。本发明包括聚烯基苯酚树脂（A）和芳香族聚马来酰亚胺化合物（B）。聚烯基苯酚树脂（A）在其分子中至少有一个芳环单元（a1），该单元上有或没有 2-烯基，其中一个酚羟基被烷基醚化，以及至少有一个芳环单元（a2），该单元上有一个酚羟基，其中有或没有 2-烯基。芳环单元（a1、a2）中至少有一个具有 2-烯基。每个芳香环单元都由一个连接基团键合。当 m 代表芳香环单元（a1）的数量，n 代表芳香环单元（a2）的数量时，n 与（m + n）的比例为 10-60%。聚烯基苯酚树脂（A）的加入量为芳香族聚马来酰亚胺化合物（B）中每摩尔马来酰亚胺基中 2-烯基的含量为 0.4-1.5 摩尔。
• CURABLE RESIN MIXTURE AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION
  申请人：Showa Denko K.K.

  公开号：EP3511363A1

  公开（公告）日：2019-07-17

  Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.

  本发明提供了一种可固化树脂混合物和一种可固化树脂组合物，其中含有一种聚烯基苯酚树脂和一种芳香族聚马来酰亚胺化合物，它们具有高结晶度和高熔点，并表现出优异的流动性和反应性。此外，还提供了一种生产可固化树脂混合物的方法，该混合物包含：(A) 聚烯基苯酚树脂，该树脂含有一种聚烯基苯酚化合物，其分子中至少有 2 个苯酚骨架，规定的 2-烯基与形成分子中苯酚骨架的部分或全部芳香环键合；(B) 芳香族聚马来酰亚胺化合物。该方法包括：将芳香族聚马来酰亚胺化合物（B）加热至熔点或熔点以上，从而使该化合物熔化；在芳香族聚马来酰亚胺化合物（B）不会再结晶的温度范围内，将熔融的芳香族聚马来酰亚胺化合物（B）和聚烯基酚树脂（A）混合。
• CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF
  申请人：Showa Denko K.K.

  公开号：EP3613780A1

  公开（公告）日：2020-02-26

  A curable resin composition with which a cured resin product having excellent heat resistance and flame retardancy can be obtained by curing is provided. A curable resin composition comprising a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1a): where R1 to R7 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, a C2-6 alkenyl group, or a hydroxy group, Y1 is an alkenyl group.

  本发明提供了一种可固化树脂组合物，使用该组合物可以通过固化获得具有优异耐热性和阻燃性的固化树脂产品。 一种可固化树脂组合物由聚烯烃基苯酚化合物（A）和聚马来酰亚胺化合物（B）组成，其中聚烯烃基苯酚化合物（A）是一种至少含有由下式（1a）表示的两个结构单元的化合物： 其中 R1 至 R7 各自独立地代表氢原子、C1-10 烷基、C1-2 烷氧基、C2-6 烯基或羟基，Y1 是烯基。
• Thermosetting resin composition
  申请人：SHOWA DENKO K.K.

  公开号：US10160856B2

  公开（公告）日：2018-12-25

  Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

  本发明提供了一种热固性树脂组合物，该组合物具有优异的可加工性，并能在固化后获得具有优异耐热性和机械强度的高可靠性固化产品（成型品）。这种热固性树脂组合物包括：聚烯基苯酚树脂（A）、芳香族聚马来酰亚胺化合物（B）和聚合引发剂（C）。聚烯基酚醛树脂（A）的分子中至少有一个芳环单元（a1），其上有一个酚羟基，该酚羟基上键合有一个 2-烯基；至少有一个芳环单元（a2），其上有一个酚羟基，该酚羟基上没有键合 2-烯基。每个芳香环单元都由一个连接基团键合，该连接基团的主链不是由芳香环形成的。当 m 代表芳香环单元（a1）的数量，n 代表芳香环单元（a2）的数量时，m 与（m+n）的比例为 40-90%。聚烯基苯酚树脂（A）的加入量为芳香族聚马来酰亚胺化合物（B）中每摩尔马来酰亚胺基中 2-烯基的含量为 0.4-1.5 摩尔。
• PHOTOSENSITIVE BISMALEIMIDE COMPOSITION
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：US20210198389A1

  公开（公告）日：2021-07-01

  The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.