申请人:E.I. DU PONT DE NEMOURS AND COMPANY
公开号:EP0474054A2
公开(公告)日:1992-03-11
Flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.
柔性多层聚酰亚胺金属包覆层压板及其制备方法,该层压板至少有一层芳香族聚酰亚胺与至少一层金属基板粘合在一起,使用的是一种可热封的共聚亚胺粘合剂,该粘合剂含有由 4,4'-氧代二酞二酸酐和芳香族醚二胺衍生的重复亚胺单元。这种层压板可用于柔性印刷电路和胶带的自动粘合。此外,金属基板可直接涂覆共聚亚胺粘合剂,并用作柔性印刷电路的单层覆膜。