Epoxy resin composition, process for providing latency to the composition and semiconductor device
申请人:Akiyama Yoshihito
公开号:US20060189721A1
公开(公告)日:2006-08-24
An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element sealed by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during sealing by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing.
(a) An anion component represented by general formula [1]:
(b) A compound represented by general formula [2]:
(c) A silane compound represented by general formula [3]:
一种环氧树脂组合物,包括环氧树脂(A)、固化剂(B)、固化促进剂(C)和至少选自由一组分(a)、(b)和(c)中的一种,该组分可以延缓环氧树脂固化(D),该组分分别由通式[1]、[2]和[3]表示。使用该组合物密封半导体元件的半导体器件,以及提供环氧树脂组合物潜伏期的方法。该环氧树脂具有优异的储存稳定性、流动性和在模压密封时的固化性能,以及在符合无铅焊接的高温焊接处理中,具有优异的抗焊接剪切和抗裂纹性能。通过调整固化促进剂和延缓固化组分的量,可以提供一种具有潜伏期的环氧树脂组合物。(a)由通式[1]表示的阴离子组分:(b)由通式[2]表示的化合物:(c)由通式[3]表示的硅烷化合物: