The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.
TETRACARBOXYLIC DIANHYDRIDE, CARBONYL COMPOUND, POLYIMIDE PRECURSOR RESIN, AND POLYIMIDE
申请人:ENEOS Corporation
公开号:US20210122724A1
公开(公告)日:2021-04-29
A tetracarboxylic dianhydride which is a compound represented by the following general formula (1):
[in the formula (1), A represents one selected from the group consisting of optionally substituted divalent aromatic groups in each of which the number of carbon atoms forming an aromatic ring is 6 to 30, and R
a
s each independently represent a hydrogen atom or the like], wherein 60% by mass or more of a stereoisomer contained in the compound is an exo/exo type stereoisomer represented by a specific general formula.
POLYIMIDE, DIAMINE COMPOUND AND METHOD FOR PRODUCING THE SAME
申请人:Yamaguchi Hiroaki
公开号:US20100041860A1
公开(公告)日:2010-02-18
A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1):
wherein, A represents a biphenylene group which may be substituted with an alkyl group having up to 4 carbon atoms.
TETRACARBOXYLIC DIANHYDRIDE, CARBONYL COMPOUND, POLYAMIC ACID AND POLYIMIDE AND METHODS RESPECTIVELY FOR PRODUCING THESE COMPOUNDS, SOLUTION PREPARED USING POLYAMIC ACID, AND FILM PRODUCED USING POLYIMIDE
申请人:JXTG Nippon Oil & Energy Corporation
公开号:EP3336083A1
公开(公告)日:2018-06-20
A tetracarboxylic dianhydride, which is a compound represented by the following general formula (1):
[in the formula (1), multiple R1s each independently represent hydrogen atom or the like, and R2 and R3 each independently represent a hydrogen atom or the like].
Disclosed are a polyimide resin containing a structural unit represented by the following formula (1-1), and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 µm. R1 and R2 in the formula (1-1) each independently represent any group of the following formulae (i) to (iv), R1 and R2 in the formula (1-2) each independently represent a group of the following formula (i) or formula (ii), and in these formulae, * bonds to the carbon with * in the formula (1-1) and the formula (1-2) and ** bonds to the carbon with ** in the formula (1-1) and the formula (1-2). A polyimide resin capable of forming a polyimide film excellent in transparency and having a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion are provided.