Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US10444628B2
公开(公告)日:2019-10-15
A compound for forming an organic film shown by the formula (1A),
RX)m1 (1A)
wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and m1 represents an integer satisfying 2≤m1≤10,
wherein X2 represents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; X3 represents a group shown by the formula (1C); and n5 represents 0, 1, or 2,
wherein R10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.
一种用于形成式 (1A) 所示有机薄膜的化合物、
RX)m1 (1A)
其中 R 代表单键或具有 1 至 50 个碳原子的有机基团;X 代表式 (1B) 所示的基团;m1 代表满足 2≤m1≤10 的整数、
其中 X2 代表具有 1 至 10 个碳原子的二价有机基团;n1 代表 0 或 1;n2 代表 1 或 2;X3 代表式(1C)所示的基团;n5 代表 0、1 或 2、
其中 R10 代表氢原子或具有 1 至 10 个碳原子的饱和或不饱和烃基,其中式(1C)中苯环的氢原子可被甲基或甲氧基取代。这种用于形成有机薄膜的化合物可提供具有良好耐干蚀刻性、400° C 或更高耐热性、高填充性和平面化性能的有机薄膜组合物。