Polymeric organosilicon systems. XXIX. Thermal properties of poly[(disilanylene)oligophenylenes]
作者:Joji Ohshita、Kazunori Sugimoto、Tsuguo Watanabe、Atsutaka Kunai、Mitsuo Ishikawa、Susumu Aoyama
DOI:10.1016/s0022-328x(98)00702-5
日期:1998.8
Thermal properties of variously substituted poly[(disilanylene)oligophenylenes], [(SiR1R2SiR1R2)(p-C6H4)m]n (R1=R2=Me, R1=R2=Et, and R1=Ph, R2=Me, m=1–4) were investigated. The thermogravimetric analysis of the polymers in the range of 20–1000°C showed rapid weight loss starting from about 400°C. The total weight loss of the polymers at 1000°C was calculated to be 54.5–75.5% based on the initial weight
各种取代的聚[(二亚硅烷基)低聚亚苯基],[(SiR 1 R 2 SiR 1 R 2)(p -C 6 H 4)m ] n(R 1 = R 2 = Me,R 1 = R 2 = Et,R 1 = Ph,R 2 = Me,m= 1–4)进行了调查。在20–1000°C范围内对聚合物进行热重分析表明,从约400°C开始,重量迅速下降。基于聚合物的初始重量,聚合物在1000°C时的总重量损失为54.5-75.5%。对聚合物进行热解得到的挥发性产物的GC-MS分析,其中R 1 = R 2 = Me,m = 2,R 1 = R 2 = Et,m = 1–4在500°C时表明形成了硅Si-Si和Si-亚苯基键断裂产生的含低聚物,主要是。H(C 6 H 4)l H(l在m = 3和4的聚合物的热解中也观察到了= 1–4)。还使用1,2-二苯基四甲基二硅烷检查了聚合物降解的模型反应。