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eicosyl-urea | 71203-46-8

中文名称
——
中文别名
——
英文名称
eicosyl-urea
英文别名
Eicosyl-harnstoff;n-Eikosyl-harnstoff;N-eicosyl-urea;icosylurea
eicosyl-urea化学式
CAS
71203-46-8
化学式
C21H44N2O
mdl
——
分子量
340.593
InChiKey
SUCJYMRDRPEZQP-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    8.9
  • 重原子数:
    24
  • 可旋转键数:
    19
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.95
  • 拓扑面积:
    55.1
  • 氢给体数:
    2
  • 氢受体数:
    1

反应信息

  • 作为产物:
    描述:
    硝基脲二十胺乙醇 作用下, 生成 eicosyl-urea
    参考文献:
    名称:
    Polynomial Operators and Green Functions - Abstract
    摘要:
    DOI:
    10.1163/156939300x01076
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文献信息

  • Process for the preparation of aqueous emulsions, stable in storage, of
    申请人:Cassella Aktiengesellschaft
    公开号:US04289665A1
    公开(公告)日:1981-09-15
    An agent for conditioning and imparting water repellency to leather comprises a homogeneous mixture of (a) 10 to 35% by weight of a compound of the formula ##STR1## wherein R is linear or branched alkyl or alkenyl each having 14 to 22 carbon atoms, m is a number average from 1.0 to 1.5 and n is 2 minus m; (b) 0 to 10% by weight of non-ionic emulsifiers; (c) 0 to 3% by weight of anionic emulsifiers with the proviso that the sum of (b) and (c) is 0.5 to 10%; (d) 0 to 5% by weight of an epoxide of the formula ##STR2## wherein R' is alkyl or alkenyl having 15 to 40 carbon atoms; (e) 0 to 25% by weight of fat liquors; and (f) 25 to 89.5% by weight of water or a water-miscible organic solvent.
    一种用于对皮革进行调理和赋予防水性的剂剂形包括:(a)式为##STR1##的化合物,其中R是具有14到22个碳原子的线性或支链烷基或烯基,m是1.0至1.5的平均数,n是2减去m,其重量占10至35%;(b)非离子乳化剂,其重量占0至10%;(c)阴离子乳化剂,其重量占0至3%,但(b)和(c)的总和为0.5至10%;(d)式为##STR2##的环氧化合物,其中R'是具有15到40个碳原子的烷基或烯基,其重量占0至5%;(e)脂肪润滑剂,其重量占0至25%;以及(f)水或可溶于水的有机溶剂,其重量占25至89.5%。
  • POLYMER
    申请人:Sumitomo Chemical Company, Ltd.
    公开号:EP3235836A1
    公开(公告)日:2017-10-25
    Provided is a polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability, namely, a polymer including constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally including constitutional units (C) represented by a specified formula, wherein where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight, and where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.
    本发明提供了一种聚合物,该聚合物能够提供一种在相变后湿度渗透性和形状保持性方面更优越且在成型加工性方面更优越的蓄热材料,即一种包括由乙烯衍生的组成单元(A)、由指定式表示的组成单元(B)以及可选地包括由指定式表示的组成单元(C)的聚合物、其中,当单元(A)、单元(B)和单元(C)的总数量为 100%时,单元(A)的数量占 70%至 99%,单元(B)和单元(C)的总数量占 1%至 30%(按重量计),而当单元(B)和单元(C)的总数量为 100%时,单元(B)的数量占 1%至 100%,单元(C)的数量占 0%至 99%。
  • RESIN PRODUCT AND MEDICINAL COMPONENT DISPENSING DEVICE
    申请人:Sumitomo Chemical Company, Limited
    公开号:EP3385332A1
    公开(公告)日:2018-10-10
    The present invention provides a resin product comprising: an active ingredient; a thermoplastic resin (2) having a melting enthalpy (ΔH) of 30 J/g or more, as observed by differential scanning calorimetry within a temperature range of 10°C or more and less than 60°C; and a thermoplastic resin (3) having a storage elastic modulus E' at 60°C of 5.0 × 105 Pa or more, as determined by dynamic viscoelasticity measurement at a frequency of 10 Hz. The present invention also provides a molded article comprising the resin product and a device for sustained-release of an active ingredient comprising a component consisting of the resin product.
    本发明提供了一种树脂产品,包括:活性成分;热塑性树脂(2),其熔化焓(ΔH)为 30 J/g 或更高,通过差示扫描量热法在 10°C 或更高且低于 60°C 的温度范围内进行观察;以及热塑性树脂(3),其在 60°C 时的存储弹性模量 E' 为 5.0 × 105 Pa 或更高,通过频率为 10 Hz 的动态粘弹性测量进行测定。本发明还提供了一种由该树脂产品组成的模塑制品和一种由该树脂产品组成的活性成分持续释放装置。
  • POLYMER, MOLDED BODY, FOAM, RESIN COMPOSITION, AND PRODUCTION METHOD FOR POLYMER
    申请人:Sumitomo Chemical Company Limited
    公开号:EP3473653A1
    公开(公告)日:2019-04-24
    Provided is a polymer having a sharp melting peak and allowing easy adjustment of the melting peak temperature. Specifically provided is a polymer comprising: two or more kinds of constitutional units containing an alkyl group having 14 or more and 30 or less carbon atoms, wherein the proportions of the number of the two or more kinds of constitutional units containing an alkyl group having 14 or more and 30 or less carbon atoms are each 20% or more, with respect to 100% of the total number of all constitutional units containing an alkyl group having 14 or more and 30 or less carbon atoms, and an enthalpy of fusion of the polymer observed within a temperature range of 10°C or higher and lower than 60°C in differential scanning calorimetry is 30 J/g or more.
    本发明提供了一种聚合物,该聚合物具有尖锐的熔峰,且易于调节熔峰温度。具体而言,该聚合物包括两种或两种以上含有碳原子数分别为 14 个或 14 个以上和 30 个或 30 个以下的烷基的结构单元,其中两种或两种以上含有碳原子数分别为 14 个或 14 个以上和 30 个或 30 个以下的烷基的结构单元的数量占所有含有碳原子数分别为 14 个或 14 个以上和 30 个以下的烷基的结构单元总数的比例均为 20%或 20%以上,且在差示扫描量热法中观察到聚合物在高于 10°C 和低于 60°C 的温度范围内的熔融焓为 30 焦耳/克或 30 焦耳/克以上。
  • RESIN COMPOSITION AND USE THEREOF
    申请人:Sumitomo Chemical Company Limited
    公开号:EP3473678A1
    公开(公告)日:2019-04-24
    Provided is a resin composition from which a heat dissipation sheet having high effect to suppress temperature elevation due to heat generated by electronic parts (elements) can be obtained. Specifically provided is a resin composition comprising: a polymer (1) whose enthalpy of fusion observed within a temperature range of 10°C or higher and lower than 60°C in differential scanning calorimetry is 30 J/g or more; and a thermally conductive material (3) whose thermal conductivity is 1 W/(m·K) or higher, wherein the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less, with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition.
    本发明提供了一种树脂组合物,通过该树脂组合物可以获得一种散热片,该散热片对抑制电子部件(元件)产生的热量引起的温度升高具有很高的效果。具体而言,本发明提供了一种树脂组合物,该树脂组合物包括:聚合物(1),其在差示扫描量热法中观察到的高于 10°C 低于 60°C 的温度范围内的熔焓大于等于 30 J/g;导热材料(3),其导热系数大于等于 1 W/(m-K),其中导热材料(3)的含量为 1 份(按重量计)以上,80 份(按重量计)以下(相对于树脂组合物所含聚合物成分总量的 100 份(按重量计))。
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