2-[(2-Methylpropan-2-yl)oxymethyl]oxirane;phenol

• 分子结构分类: 有机化合物 - 苯类化合物 - 酚类
• 英文名称: 2-[(2-Methylpropan-2-yl)oxymethyl]oxirane;phenol
• 英文别名: 2-[(2-methylpropan-2-yl)oxymethyl]oxirane;phenol
• 化学式: C13H20O3
• 分子量: 224.3
• InChiKey: GMFDYSKYURQMEA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.59
• 重原子数：
  16
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.54
• 拓扑面积：
  42
• 氢给体数：
  1
• 氢受体数：
  3

文献信息

• Hydrazide-based curing agents for use in subterranean operations
  申请人：Halliburton Energy Services, Inc.

  公开号：US10287478B2

  公开（公告）日：2019-05-14

  Curable resin compositions comprising an epoxy resin and a hydrazide curing agent and methods for using the curable resin compositions in cementing and/or remedial operations in a subterranean formation are provided. In one embodiment, the method may comprise combining an epoxy resin and a curing agent to form a curable resin composition, wherein the curing agent comprises a hydrazide curing agent; introducing the curable resin composition into a subterranean formation; and allowing the curable resin composition to at least partially cure.

  本发明提供了包含环氧树脂和酰肼固化剂的可固化树脂组合物，以及将可固化树脂组合物用于地下地层固井和/或补救作业的方法。在一个实施例中，该方法可包括将环氧树脂和固化剂结合形成可固化树脂组合物，其中固化剂包括酰肼固化剂；将可固化树脂组合物引入地下地层；并使可固化树脂组合物至少部分固化。
• UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME
  申请人：Henkel IP & Holding GmbH

  公开号：EP2948506A1

  公开（公告）日：2015-12-02
• HYDRAZIDE-BASED CURING AGENTS FOR USE IN SUBTERRANEAN OPERATIONS
  申请人：Halliburton Energy Services, Inc.

  公开号：US20170349804A1

  公开（公告）日：2017-12-07

  Curable resin compositions comprising an epoxy resin and a hydrazide curing agent and methods for using the curable resin compositions in cementing and/or remedial operations in a subterranean formation are provided. In one embodiment, the method may comprise combining an epoxy resin and a curing agent to form a curable resin composition, wherein the curing agent comprises a hydrazide curing agent; introducing the curable resin composition into a subterranean formation; and allowing the curable resin composition to at least partially cure.
• US9688892B2
  申请人：——

  公开号：US9688892B2

  公开（公告）日：2017-06-27
• [EN] UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME<br/>[FR] COMPOSITION DE MATIÈRE DE REMPLISSAGE ENTRE COMPOSANTS EMPILÉS ET PROCÉDÉ D'ENCAPSULATION FAISANT INTERVENIR CELLE-CI
  申请人：HENKEL IP & HOLDING GMBH

  公开号：WO2014113931A1

  公开（公告）日：2014-07-31

  Provided is a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.