Film-forming compositions are provided comprising: (a) a zwitterionic-functional polymer; and (b) an organometallic compound. Also provided are methods of reducing adhesion of an organic substance to a substrate and methods of treating a siliceous or metal (M) oxide-containing subterranean formation penetrated by a well using the film-forming compositions described above.
成膜组合物包括:(a) 齐聚物官能团聚合物;(b) 有机
金属化合物。此外,还提供了减少有机物质对基质的附着力的方法,以及使用上述成膜组合物处理由井穿透的含
硅或
金属(M)氧化物地下地层的方法。