Benzo[a]phenazinium, 7-phenyl-5,9-bis(phenylamino)-4,10-disulfo-, inner salt, monosodium salt | 6378-88-7

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 二氮杂萘
• 英文名称: Benzo[a]phenazinium, 7-phenyl-5,9-bis(phenylamino)-4,10-disulfo-, inner salt, monosodium salt
• 英文别名: sodium;5,9-dianilino-7-phenylbenzo[a]phenazin-7-ium-4,10-disulfonate
• CAS: 6378-88-7
• 化学式: C34H23N4NaO6S2
• 分子量: 670.7
• InChiKey: RBYJOOWYRXEJAM-UHFFFAOYSA-M

计算性质

• 辛醇/水分配系数(LogP)：
  3.12
• 重原子数：
  47
• 可旋转键数：
  5
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  172
• 氢给体数：
  2
• 氢受体数：
  9

文献信息

• Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate
  申请人：Atotech Deutschland GmbH

  公开号：US10982343B2

  公开（公告）日：2021-04-20

  The present invention relates to a plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least one phenazine dye and at least one ethanediamine derivative. The present invention further concerns the use of above plating composition and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate.

  本发明涉及一种用于电解沉铜的电镀组合物，该组合物包括铜离子、卤化物离子和至少一种酸、至少一种苯并噻唑化合物、至少一种吩嗪染料和至少一种乙二胺衍生物。本发明进一步涉及上述电镀组合物的使用以及在基底的至少一个表面上电解沉积铜或铜合金层的方法。
• PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE
  申请人：Atotech Deutschland GmbH

  公开号：US20200347504A1

  公开（公告）日：2020-11-05

  The present invention relates to a plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least one phenazine dye and at least one ethanediamine derivative. The present invention further concerns the use of above plating composition and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate.