申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP3187554A1
公开(公告)日:2017-07-05
A condensation curable resin composition comprising a silphenylene oligomer skeleton-bearing organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule cures into a product having both a satisfactory hardness and crack resistance.
一种可缩合固化的树脂组合物,包含一种硅亚苯基低聚物骨架有机硅化合物,每个分子至少有两个羟基和/或烷氧基,固化后的产品具有令人满意的硬度和抗裂性。