The present invention relates to methods of using amidoxime compositions for cleaning polishing pads, particularly after chemical mechanical planarization or polishing is provided. A polishing pad is cleaned of Cu CMP by-products, subsequent to or during planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising an aqueous amidoxime compound solution in water.
本发明涉及使用
氨基甲酰
肼组合物清洁抛光垫的方法,特别是在
化学机械平面化或抛光后提供的方法。在平面化晶片的过程中或之后,通过在抛光垫表面涂布含有
水的
氨基甲酰
肼化合物溶液的组合物,清除
铜化学机械抛光副产物,以减少垫面光泽。