CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, PROCESS FOR PRODUCING CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, METAL-LAYER-COATED RESIN FILM MADE FROM THE SAME, AND PROCESS FOR PRODUCING METAL-LAYER-COATED RESIN FILM
申请人:Fujifilm Corporation
公开号:EP2133200A1
公开(公告)日:2009-12-16
The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal. This conductive substance-adsorbing resin film is allowed to adsorb a metal and subjected to plating, whereby a metal layer-coated resin film can be obtained.
本发明提供了一种导电物质吸附树脂薄膜,在该薄膜上可以很容易地形成导电层,该导电层与树脂薄膜的附着力极佳,并且与树脂薄膜的界面不平整度较低、通过使用本发明的导电物质吸附树脂膜而获得的、可以容易地在其上形成与绝缘树脂膜附着性优良的高清晰配线的金属层涂覆树脂膜,以及作为能够容易地制造具有高清晰配线的印刷线路板的材料的金属层涂覆树脂膜的制造方法。本发明还提供了一种导电物质吸附树脂薄膜,包括至少两个树脂层,其中至少一个树脂层是具有吸附导电物质或金属特性的吸附树脂层。这种导电物质吸附树脂薄膜可以吸附金属并进行电镀,从而获得金属层涂层树脂薄膜。