申请人:International Business Machines
Corporation
公开号:EP0464371A1
公开(公告)日:1992-01-08
A structure comprising a free-standing polyamic acid film substantially free of phthalic acids. A method of fabricating such a structure which comprises applying a polyamic acid solution to a substrate, partially or substantially completely removing the solvent from the polyamic acid solution by heating the same, removing the free-standing polyamic acid film which is free from phthalic acids, laminating the film to a substrate at elevated temperature and pressure and thermally curing the laminated, free-standing polyamic acid film to the corresponding polyimide. A structure comprising one or a plurality of such free-standing polyamic acid films with electrically conducting layers therebetween is also disclosed as is a method of fabricating such a structure. Further disclosed is the use of a thermoplastic polyimide adhesive precursor which permits 2nd level multilayer packaging applications and a method for forming such packaging.
一种结构,包括一层基本上不含邻苯二甲酸的独立聚amic acid 薄膜。制造这种结构的方法包括:将聚酰胺酸溶液涂抹在基底上,通过加热将溶剂从聚酰胺酸溶液中部分或基本完全去除,去除不含邻苯二甲酸的独立聚酰胺酸薄膜,在高温高压下将薄膜层压到基底上,并将层压的独立聚酰胺酸薄膜热固化到相应的聚酰亚胺上。此外,还公开了一种结构,该结构包括一个或多个此类独立的聚酰胺酸薄膜,薄膜之间有导电层,还公开了制造这种结构的方法。此外,还公开了一种热塑性聚酰亚胺粘合剂前体的使用方法,这种粘合剂前体可用于第 2 层多层包装,还公开了形成这种包装的方法。