Naphthalen-1-ol;phenol | 42791-88-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: Naphthalen-1-ol;phenol
• CAS: 42791-88-8
• 化学式: C16H14O2
• 分子量: 238.28
• InChiKey: VSWALKINGSNVAR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.94
• 重原子数：
  18
• 可旋转键数：
  0
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• PHOTOACID GENERATOR, AND RESIN COMPOSITION FOR PHOTOLITHOGRAPHY
  申请人：SAN-APRO LTD.

  公开号：US20160368879A1

  公开（公告）日：2016-12-22

  Provided is a non-ionic photoacid generator (A) expressed by general formula (1). R1 and R2 each independently represents an alkyl group having 1-18 carbons or a fluoroalkyl group having 1-18 carbons, an alkenyl group having 2-18 carbons, an alkynyl group having 2-18 carbons, an aryl group having 6-18 carbons, a silyl group, or the like; m and n respectively represent the number of R1s and R2s, each number being an integer from 0 to 3, and the total number (m+n) of R1s and R2s being an integer from 1 to 6. The m number of R1s and the n number of R2s may each be the same or different. R3 represents a hydrocarbon having 1-18 carbons wherein one part or all of the hydrogen may be substituted by fluorine.

  提供的非离子光酸发生剂（A）由通式（1）表示。R1和R2分别独立表示具有1-18个碳原子的烷基基团或具有1-18个碳原子的氟烷基基团，具有2-18个碳原子的烯基基团，具有2-18个碳原子的炔基基团，具有6-18个碳原子的芳基基团，硅基团等；m和n分别表示R1和R2的数量，每个数字为0到3的整数，R1和R2的总数（m+n）为1到6的整数。R1的数量m和R2的数量n可以相同也可以不同。R3表示具有1-18个碳原子的碳氢化合物，其中氢的一部分或全部可以被氟取代。
• SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND
  申请人：DIC CORPORATION

  公开号：US20200325101A1

  公开（公告）日：2020-10-15

  Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

  亚苯基马来酰亚胺化合物，具有三个或更多苯环的结构，含有一个或多个取代或未取代的烯丙基团，以及一个或多个马来酰亚胺基团，具有卓越的耐热性。
• NOVOLAC RESIN AND RESIST FILM
  申请人：DIC Corporation

  公开号：US20180334523A1

  公开（公告）日：2018-11-22

  Provided are a novolac resin having developability, heat resistance, and dry etching resistance, and a photosensitive composition, a curable composition, and a resist film. A novolac resin including, as a repeating unit, a structural moiety represented by Structural Formula (1) or (2): (in the formula, Ar represents an arylene group, R 1 's each independently represent any one of a hydrogen atom, an alkyl group, an alkoxy group, and a halogen atom, m's each independently represent an integer of 1 to 3, and X is any one of a hydrogen atom, a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group) in which at least one of X's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group.

  提供一种具有可开发性、耐热性和干法蚀刻抗性的新戊醛树脂，以及一种光敏组合物、可固化组合物和抗蚀膜。一种新戊醛树脂包括以下结构单元： （在公式中，Ar代表芳基，R 1 分别独立地代表氢原子、烷基、烷氧基和卤素原子中的任意一种，m分别独立地代表1至3的整数，X代表氢原子、三级烷基、烷氧基烷基、酰基、烷氧羰基、含杂原子的环烃基和三烷基硅基中的任意一种），树脂中至少有一个X是三级烷基、烷氧基烷基、酰基、烷氧羰基、含杂原子的环烃基和三烷基硅基中的任意一种。
• COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20160046552A1

  公开（公告）日：2016-02-18

  A composition containing a novel vinyl-group-containing compound. This composition contains a vinyl-group-containing compound represented by general formula (1). In the formula: W 1 and W 2 represent a group represented by general formula (2) (where a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or —S—, R 1 is a single bond or a C1-4 alkylene group, R 2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer equal to 0 or higher), a group represented by general formula (4) (where the ring (Z), X, R 1 , R 2 , and m are as previously stated), a hydroxyl group, or a (meth)acryloyloxy group; rings (Y 1 , Y 2 ) are aromatic hydrocarbon rings; R represents a single bond or a specific divalent group; R 3a and R 3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon group; and n1 and n2 are integers of 0-4.

  这个组合物包含一种含有新颖乙烯基团的化合物。该组合物包含一个由通式（1）表示的含有乙烯基团的化合物。在该式中：W1和W2代表由通式（2）表示的一个基团（其中环（Z）是芳香烃环，X是一个单键或—S—，R1是一个单键或C1-4烷基基团，R2是特定的取代基团，如一价碳氢化合物，m是大于或等于0的整数），一个由通式（4）表示的基团（其中环（Z）、X、R1、R2和m如前述），一个羟基，或一个（甲基）丙烯酰氧基团；环（Y1、Y2）是芳香烃环；R代表一个单键或一个特定的二价基团；R3a和R3b代表氰基、卤素原子或一价碳氢基团；n1和n2是0-4的整数。
• PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED FROM THE SAME
  申请人：SAMSUNG SDI CO., LTD.

  公开号：US20160115184A1

  公开（公告）日：2016-04-28

  A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:

  一种磷铵化合物，一种环氧树脂组合物，一种制备磷铵化合物的方法，以及用环氧树脂组合物封装的半导体器件，该化合物由式子1表示。