2-(3,5-Di-tert-butyl-4-hydroxyphenyl)ethyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propanoate

• 分子结构分类: 有机化合物 - 苯类化合物 - 酚类
• 英文名称: 2-(3,5-Di-tert-butyl-4-hydroxyphenyl)ethyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propanoate
• 英文别名: 2-(3,5-ditert-butyl-4-hydroxyphenyl)ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate
• 化学式: C₃₃H₅₀O₄
• 分子量: 510.7
• InChiKey: QKAPZAFIMTUNAD-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  9.9
• 重原子数：
  37
• 可旋转键数：
  11
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.61
• 拓扑面积：
  66.8
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• Cured film formed by curing photosensitive resin composition and method for manufacturing same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10545406B2

  公开（公告）日：2020-01-28

  Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

  本发明提供了一种对金属铜具有高延伸率、低应力和高附着力的固化薄膜。该固化膜是通过固化感光树脂组合物形成的，其中感光树脂包括聚羟酰胺，固化膜中聚羟酰胺的环闭率不超过 10%。
• Resin and photosensitive resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11174350B2

  公开（公告）日：2021-11-16

  A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

  本发明提供了一种树脂和一种光敏树脂组合物，通过该树脂和组合物可以获得具有高延伸性、低应力和高金属粘附性的固化薄膜。一种树脂（A）包括聚酰胺结构和至少任何一种亚胺前体结构和亚胺结构，其中树脂（A）的至少任何一种结构包括具有脂肪族基团的二胺残基。
• Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11279802B2

  公开（公告）日：2022-03-22

  The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.

  本发明提供了一种碱溶性树脂，利用其可以获得具有高延伸性、低应力、对金属的高附着力以及高耐热性的固化膜，并提供含有该碱溶性树脂的光敏树脂组合物。本发明的碱溶性树脂(A)包含由通式(1)表示的结构，其中X1表示具有2至100个碳原子的二价有机基团，Y1和Y2各自表示具有2至100个碳原子的二价至六价有机基团，X2表示具有2至100个碳原子的四价有机基团，p和q各自表示0至4之间的整数，n1和n2各自表示5至100,000之间的整数，并且满足以下(I)和(II)条件： (I) 在通式(1)中，作为X1的含有具有8至30个碳原子的脂肪链的有机基团的含量基于X1和X2的总量为30至70摩尔%； (II) 在通式(1)中，作为Y1的含有二苯醚结构的有机基团的含量基于Y1和Y2的总量为1至30摩尔%。
• CURED FILM AND METHOD FOR MANUFACTURING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20180203353A1

  公开（公告）日：2018-07-19

  Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.
• RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20190081258A1

  公开（公告）日：2019-03-14

  A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.